Heat Sinks

Results: 2
Manufacturer
Advanced Thermal Solutions Inc.CUI Devices
Series
-HSB
Packaging
BoxBulk
Attachment Method
Adhesive (Not Included)Thermal Tape, Adhesive (Not Included)
Shape
Square, FinsSquare, Pin Fins
Length
1.378" (35.00mm)1.575" (40.00mm)
Width
1.378" (35.00mm)1.575" (40.00mm)
Fin Height
0.315" (8.00mm)0.394" (10.00mm)
Power Dissipation @ Temperature Rise
6.3W @ 75°C-
Thermal Resistance @ Forced Air Flow
3.90°C/W @ 200 LFM11.29°C/W @ 200 LFM
Thermal Resistance @ Natural
11.84°C/W-
Material
AluminumAluminum Alloy
Stocking Options
Environmental Options
Media
Marketplace Product
2Results
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of 2
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Mfr Part #
Quantity Available
Price
Series
Package
Product Status
Type
Package Cooled
Attachment Method
Shape
Length
Width
Diameter
Fin Height
Power Dissipation @ Temperature Rise
Thermal Resistance @ Forced Air Flow
Thermal Resistance @ Natural
Material
Material Finish
HSB15-404010
HSB15-404010
HEAT SINK, BGA, 40 X 40 X 10 MM
CUI Devices
499
In Stock
1 : ¥9.11000
Box
Box
Active
Top Mount
BGA
Adhesive (Not Included)
Square, Pin Fins
1.575" (40.00mm)
1.575" (40.00mm)
-
0.394" (10.00mm)
6.3W @ 75°C
3.90°C/W @ 200 LFM
11.84°C/W
Aluminum Alloy
Black Anodized
48
In Stock
1 : ¥27.34000
Bulk
-
Bulk
Active
Top Mount
BGA
Thermal Tape, Adhesive (Not Included)
Square, Fins
1.378" (35.00mm)
1.378" (35.00mm)
-
0.315" (8.00mm)
-
11.29°C/W @ 200 LFM
-
Aluminum
Black Anodized
Showing
of 2

Heat Sinks

Passive heat exchangers that transfer the heat generated by an electronic component to a fluid medium, often air or a liquid coolant, dissipating it away from the device to maintain an optimal operating temperature. They are designed to maximize the surface area in contact with the medium surrounding it. They are usually made out of copper or aluminum due to their high thermal conductivity.