Heat Sinks

Results: 4
Shape
Rectangular, Angled FinsRectangular, Fins
Length
1.969" (50.00mm)2.953" (75.00mm)
Width
1.102" (28.00mm)1.181" (30.00mm)
Fin Height
1.772" (45.00mm)1.969" (50.00mm)
Power Dissipation @ Temperature Rise
10.53W @ 75°C12.79W @ 75°C13.26W @ 75°C15.46W @ 75°C
Thermal Resistance @ Forced Air Flow
2.10°C/W @ 200 LFM2.50°C/W @ 200 LFM2.70°C/W @ 200 LFM
Thermal Resistance @ Natural
4.85°C/W5.66°C/W5.86°C/W7.13°C/W
Stocking Options
Environmental Options
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Marketplace Product
4Results

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Mfr Part #
Quantity Available
Price
Series
Package
Product Status
Type
Package Cooled
Attachment Method
Shape
Length
Width
Diameter
Fin Height
Power Dissipation @ Temperature Rise
Thermal Resistance @ Forced Air Flow
Thermal Resistance @ Natural
Material
Material Finish
HSE06-503045
HSE06-503045
HEAT SINK, EXTRUSION, TO-218/TO-
CUI Devices
930
In Stock
1 : ¥13.55000
Bag
Bag
Active
Board Level
TO-218, TO-220
Clip
Rectangular, Fins
1.969" (50.00mm)
1.181" (30.00mm)
-
1.772" (45.00mm)
12.79W @ 75°C
2.10°C/W @ 200 LFM
5.86°C/W
Aluminum Alloy
Black Anodized
HSE09-755028
HSE09-755028
HEAT SINK, EXTRUSION, TO-218/TO-
CUI Devices
956
In Stock
1 : ¥28.32000
Bag
Bag
Active
Board Level
TO-218, TO-220
Clip
Rectangular, Angled Fins
2.953" (75.00mm)
1.102" (28.00mm)
-
1.969" (50.00mm)
13.26W @ 75°C
2.50°C/W @ 200 LFM
5.66°C/W
Aluminum Alloy
Black Anodized
HSE08-505028
HSE08-505028
HEAT SINK, EXTRUSION, TO-218/TO-
CUI Devices
718
In Stock
280 : ¥15.78775
Bag
Bag
Active
Board Level
TO-218, TO-220
Clip
Rectangular, Angled Fins
1.969" (50.00mm)
1.102" (28.00mm)
-
1.969" (50.00mm)
10.53W @ 75°C
2.70°C/W @ 200 LFM
7.13°C/W
Aluminum Alloy
Black Anodized
HSE07-753045
HSE07-753045
HEAT SINK, EXTRUSION, TO-218/TO-
CUI Devices
965
In Stock
1 : ¥19.62000
Bag
Bag
Active
Board Level
TO-218, TO-220
Clip
Rectangular, Fins
2.953" (75.00mm)
1.181" (30.00mm)
-
1.772" (45.00mm)
15.46W @ 75°C
2.10°C/W @ 200 LFM
4.85°C/W
Aluminum Alloy
Black Anodized
Showing
of 4

Heat Sinks


Passive heat exchangers that transfer the heat generated by an electronic component to a fluid medium, often air or a liquid coolant, dissipating it away from the device to maintain an optimal operating temperature. They are designed to maximize the surface area in contact with the medium surrounding it. They are usually made out of copper or aluminum due to their high thermal conductivity.