Adhesives, Epoxies, Greases, Pastes

Results: 2
Manufacturer
Chip Quik Inc.MG Chemicals
Series
-CHIPQUIK®
Type
Epoxy, 2 PartSilicone Compound
Size / Dimension
25 ml Syringe1 gram Syringe
Usable Temperature Range
-67°F ~ 329°F (-50°C ~ 165°C)-40°F ~ 302°F (-40°C ~ 150°C)
Color
GrayWhite
Thermal Conductivity
0.90W/m-K8.50W/m-K
Shelf Life
36 Months60 Months
Storage/Refrigeration Temperature
37°F ~ 77°F (3°C ~ 25°C)50°F ~ 86°F (10°C ~ 30°C)
Stocking Options
Environmental Options
Media
Marketplace Product
2Results
Showing
of 2
Compare
Mfr Part #
Quantity Available
Price
Series
Package
Product Status
Type
Size / Dimension
Usable Temperature Range
Color
Thermal Conductivity
Features
Shelf Life
Storage/Refrigeration Temperature
TC3-1G
TC3-1G
HEAT SINK THERMAL COMPOUND
Chip Quik Inc.
356
In Stock
1 : ¥51.67000
Bulk
Bulk
Active
Silicone Compound
1 gram Syringe
-40°F ~ 302°F (-40°C ~ 150°C)
Gray
8.50W/m-K
-
60 Months
37°F ~ 77°F (3°C ~ 25°C)
8349TFM-25ML
8349TFM-25ML
THERMAL ADHESIVE 25ML
MG Chemicals
105
In Stock
1 : ¥336.74000
Bulk
-
Bulk
Active
Epoxy, 2 Part
25 ml Syringe
-67°F ~ 329°F (-50°C ~ 165°C)
White
0.90W/m-K
-
36 Months
50°F ~ 86°F (10°C ~ 30°C)
Showing
of 2

Adhesives, Epoxies, Greases, Pastes

Products in this family are fluids, gels, or semi-solids used primarily to aid the heat transfer between objects such as a transistor and a heatsink or a printed circuit board assembly and a device enclosure. A variety of materials are included, some of which provide additional functions such as adhesive bonding, mechanical cushioning and shock absorption, or environmental sealing.