Adhesives, Epoxies, Greases, Pastes

Results: 4
Manufacturer
MG ChemicalsShiu Li Technology Co., Ltd.
Series
8329TCSLiPOLY® EPDM20LiPOLY® EPDM30LiPOLY® PK223DM
Packaging
BulkRetail Package
Type
Epoxy, 2 PartLiquid Gap Filler, 2 Part
Size / Dimension
6 ml Syringe50 ml Cartridges110 gram Cartridge
Usable Temperature Range
-76°F ~ 392°F (-60°C ~ 200°C)-40°F ~ 248°F (-40°C ~ 120°C)-40°F ~ 302°F (-40°C ~ 150°C)
Color
Black, WhiteGray
Thermal Conductivity
1.40W/m-K2.00W/m-K2.2W/m-K3.00W/m-K
Features
-Low Outgassing (ASTM E595)
Shelf Life
24 Months36 Months
Storage/Refrigeration Temperature
41°F ~ 95°F (5°C ~ 35°C)50°F ~ 86°F (10°C ~ 30°C)
Stocking Options
Environmental Options
Media
Marketplace Product
4Results

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Mfr Part #
Quantity Available
Price
Series
Package
Product Status
Type
Size / Dimension
Usable Temperature Range
Color
Thermal Conductivity
Features
Shelf Life
Storage/Refrigeration Temperature
8329TCx-6ML
8329TCS-6ML
ADHESIVE - THERMAL CONDUCTIVE EP
MG Chemicals
161
In Stock
1 : ¥295.48000
Bulk
Bulk
Active
Epoxy, 2 Part
6 ml Syringe
-40°F ~ 302°F (-40°C ~ 150°C)
Gray
1.40W/m-K
Low Outgassing (ASTM E595)
36 Months
50°F ~ 86°F (10°C ~ 30°C)
EPDM20-135
EPDM20-135
NON-SILICONE TWO-PART THERMAL LI
Shiu Li Technology Co., Ltd.
78
In Stock
1 : ¥769.46000
Retail Package
Retail Package
Active
Liquid Gap Filler, 2 Part
50 ml Cartridges
-40°F ~ 248°F (-40°C ~ 120°C)
Black, White
2.2W/m-K
-
24 Months
41°F ~ 95°F (5°C ~ 35°C)
EPDM30-135
EPDM30-135
NON-SILICONE TWO-PART THERMAL LI
Shiu Li Technology Co., Ltd.
95
In Stock
1 : ¥1,086.66000
Retail Package
Retail Package
Active
Liquid Gap Filler, 2 Part
50 ml Cartridges
-40°F ~ 248°F (-40°C ~ 120°C)
Black, White
3.00W/m-K
-
24 Months
41°F ~ 95°F (5°C ~ 35°C)
PK223DM
PK223DM-110
TWO-PART THERMAL LIQUID GAP FILL
Shiu Li Technology Co., Ltd.
10
In Stock
1 : ¥388.62000
Retail Package
Retail Package
Active
Liquid Gap Filler, 2 Part
110 gram Cartridge
-76°F ~ 392°F (-60°C ~ 200°C)
Gray
2.00W/m-K
-
24 Months
41°F ~ 95°F (5°C ~ 35°C)
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of 4

Adhesives, Epoxies, Greases, Pastes


Products in this family are fluids, gels, or semi-solids used primarily to aid the heat transfer between objects such as a transistor and a heatsink or a printed circuit board assembly and a device enclosure. A variety of materials are included, some of which provide additional functions such as adhesive bonding, mechanical cushioning and shock absorption, or environmental sealing.