Solder

Results: 3
Packaging
BulkDispenser
Composition
Bi57.6Sn42Ag0.4 (57.6/42/0.4)Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Melting Point
281°F (138°C)423 ~ 428°F (217 ~ 220°C)
Mesh Type
34
Form
Jar, 1.76 oz (50g)Syringe, 0.53 oz (15g), 5cc
Shelf Life
6 Months12 Months
Storage/Refrigeration Temperature
37°F ~ 46°F (3°C ~ 8°C)68°F ~ 77°F (20°C ~ 25°C)
Stocking Options
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Media
Marketplace Product
3Results
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Mfr Part #
Quantity Available
Price
Series
Package
Product Status
Type
Composition
Diameter
Melting Point
Flux Type
Wire Gauge
Mesh Type
Process
Form
Shelf Life
Shelf Life Start
Storage/Refrigeration Temperature
SMD291SNL
SMD291SNL
SOLDER PASTE NO-CLEAN LF 5CC SYR
Chip Quik Inc.
38
In Stock
1 : ¥140.24000
Dispenser
-
Dispenser
Active
Solder Paste
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
-
423 ~ 428°F (217 ~ 220°C)
No-Clean
-
3
Lead Free
Syringe, 0.53 oz (15g), 5cc
6 Months
Date of Manufacture
37°F ~ 46°F (3°C ~ 8°C)
TS391LT50
TS391LT50
THERMALLY STABLE SOLDER PASTE NO
Chip Quik Inc.
31
In Stock
1 : ¥190.60000
Bulk
-
Bulk
Active
Solder Paste
Bi57.6Sn42Ag0.4 (57.6/42/0.4)
-
281°F (138°C)
No-Clean
-
4
Lead Free
Jar, 1.76 oz (50g)
12 Months
Date of Manufacture
68°F ~ 77°F (20°C ~ 25°C)
TS391SNL
TS391SNL
THERMALLY STABLE SOLDER PASTE NO
Chip Quik Inc.
15
In Stock
1 : ¥147.18000
Bulk
-
Bulk
Active
Solder Paste
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
-
423 ~ 428°F (217 ~ 220°C)
No-Clean
-
4
Lead Free
Syringe, 0.53 oz (15g), 5cc
12 Months
Date of Manufacture
68°F ~ 77°F (20°C ~ 25°C)
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of 3

Solder

Solder is Metal Alloys that are used to join metal surfaces to each other. The types are bar solder, ribbon solder, solder paste, solder shot, solder sphere, or wire solder in diameters ranging from 0.006” (0.15mm) to 0.250” (6.35mm) with melting point ranging from 244°F (118°C) to 1983°F (1084°C) in lead free or leaded. The flux type is acid cored, no-clean, rosin activated, rosin mildly activated, or water soluble.