Solder

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Mfr Part #	Quantity Available	Price	Series	Package	Product Status	Type	Composition	Diameter	Melting Point	Flux Type	Wire Gauge	Mesh Type	Process	Form	Shelf Life	Shelf Life Start	Storage/Refrigeration Temperature

SMDLTLFP SOLDER PASTE LOW TEMP 5CC W/TIP Chip Quik Inc.	17 In Stock	1 : ¥138.50000 Dispenser	-	Dispenser	Active	Solder Paste	Bi57.6Sn42Ag0.4 (57.6/42/0.4)	-	281°F (138°C)	No-Clean	-	3	Lead Free	Syringe, 0.53 oz (15g), 5cc	6 Months	Date of Manufacture	37°F ~ 46°F (3°C ~ 8°C)
TS391LT THERMALLY STABLE SOLDER PASTE NO Chip Quik Inc.	58 In Stock	1 : ¥147.18000 Bulk	-	Bulk	Active	Solder Paste	Bi57.6Sn42Ag0.4 (57.6/42/0.4)	-	281°F (138°C)	No-Clean	-	4	Lead Free	Syringe, 0.53 oz (15g), 5cc	12 Months	Date of Manufacture	68°F ~ 77°F (20°C ~ 25°C)
SMDLTLFP10 SOLDER PASTE LOW TEMP 10CC W/TIP Chip Quik Inc.	10 In Stock	1 : ¥190.60000 Dispenser	-	Dispenser	Active	Solder Paste	Bi57.6Sn42Ag0.4 (57.6/42/0.4)	-	281°F (138°C)	No-Clean	-	3	Lead Free	Syringe, 1.23 oz (35g), 10cc	6 Months	Date of Manufacture	37°F ~ 46°F (3°C ~ 8°C)
SMD291SNL10T4 SLDR PST NO-CLEAN SAC305 T4 10CC Chip Quik Inc.	4 In Stock	1 : ¥260.07000 Dispenser	-	Dispenser	Active	Solder Paste	Sn96.5Ag3Cu0.5 (96.5/3/0.5)	-	423 ~ 428°F (217 ~ 220°C)	No-Clean	-	4	Lead Free	Syringe, 1.23 oz (35g), 10cc	6 Months	Date of Manufacture	37°F ~ 46°F (3°C ~ 8°C)

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Solder

Solder is Metal Alloys that are used to join metal surfaces to each other. The types are bar solder, ribbon solder, solder paste, solder shot, solder sphere, or wire solder in diameters ranging from 0.006” (0.15mm) to 0.250” (6.35mm) with melting point ranging from 244°F (118°C) to 1983°F (1084°C) in lead free or leaded. The flux type is acid cored, no-clean, rosin activated, rosin mildly activated, or water soluble.