IC Sockets

Results: 15
Manufacturer
3MAries ElectronicsOn Shore Technology Inc.
Series
55SATextool™
Packaging
BulkTrayTube
Type
DIP, 0.3" (7.62mm) Row SpacingDIP, ZIF (ZIP), 0.3" (7.62mm) Row SpacingDIP, ZIF (ZIP), 0.4" (10.16mm) Row SpacingDIP, ZIF (ZIP), 0.6" (15.24mm) Row SpacingSOIC
Number of Positions or Pins (Grid)
8 (2 x 4)14 (2 x 7)16 (2 x 8)18 (2 x 9)20 (2 x 10)22 (2 x 11)24 (2 x 12)28 (2 x 14)32 (2 x 16)40 (2 x 20)48 (2 x 24)
Pitch - Mating
0.070" (1.78mm)0.100" (2.54mm)-
Contact Finish - Mating
GoldTin
Contact Finish Thickness - Mating
30.0µin (0.76µm)200.0µin (5.08µm)-Flash
Mounting Type
ConnectorThrough Hole
Features
Closed FrameOpen Frame
Termination
Press-FitSolder
Pitch - Post
0.100" (2.54mm)-
Contact Finish - Post
GoldTin
Contact Finish Thickness - Post
30.0µin (0.76µm)200.0µin (5.08µm)
Contact Material - Post
Beryllium CopperBrass
Housing Material
Polyethersulfone (PES), Glass FilledPolyphenylene Sulfide (PPS), Glass FilledPolysulfone (PSU), Glass FilledThermoplastic, Polyester, Glass Filled
Operating Temperature
-55°C ~ 125°C-55°C ~ 150°C-40°C ~ 105°C-
Stocking Options
Environmental Options
Media
Marketplace Product
15Results

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Mfr Part #
Quantity Available
Price
Series
Package
Product Status
Type
Number of Positions or Pins (Grid)
Pitch - Mating
Contact Finish - Mating
Contact Finish Thickness - Mating
Contact Material - Mating
Mounting Type
Features
Termination
Pitch - Post
Contact Finish - Post
Contact Finish Thickness - Post
Contact Material - Post
Housing Material
Operating Temperature
SA163000
SA163000
CONN IC DIP SOCKET 16POS GOLD
On Shore Technology Inc.
7,655
In Stock
1 : ¥9.03000
Tube
Tube
Active
DIP, 0.3" (7.62mm) Row Spacing
16 (2 x 8)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200.0µin (5.08µm)
Brass
Thermoplastic, Polyester, Glass Filled
-40°C ~ 105°C
214-3339-00-0602J
214-3339-00-0602J
CONN IC DIP SOCKET ZIF 14POS GLD
3M
498
In Stock
1 : ¥187.43000
Tube
Tube
Active
DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
14 (2 x 7)
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Connector
Closed Frame
Press-Fit
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Polysulfone (PSU), Glass Filled
-55°C ~ 125°C
220-3342-00-0602J
220-3342-00-0602J
CONN IC DIP SOCKET ZIF 20POS GLD
3M
395
In Stock
1 : ¥199.42000
Tube
Tube
Active
DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
20 (2 x 10)
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Connector
Closed Frame
Press-Fit
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Polysulfone (PSU), Glass Filled
-55°C ~ 125°C
208-7391-55-1902
208-7391-55-1902
CONN SOCKET SOIC 8POS GOLD
3M
264
In Stock
1 : ¥301.14000
Bulk
Bulk
Active
SOIC
8 (2 x 4)
-
Gold
30.0µin (0.76µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
-
Gold
30.0µin (0.76µm)
Beryllium Copper
Polyethersulfone (PES), Glass Filled
-55°C ~ 150°C
248-1282-00-0602J
248-1282-00-0602J
CONN IC DIP SOCKET ZIF 48POS GLD
3M
327
In Stock
1 : ¥326.59000
Tube
Tube
Active
DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
48 (2 x 24)
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Connector
Closed Frame
Press-Fit
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Polysulfone (PSU), Glass Filled
-55°C ~ 125°C
32-6554-10
32-6554-10
CONN IC DIP SOCKET ZIF 32POS TIN
Aries Electronics
272
In Stock
1 : ¥133.00000
Bulk
Bulk
Active
DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
32 (2 x 16)
0.100" (2.54mm)
Tin
200.0µin (5.08µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin
200.0µin (5.08µm)
Beryllium Copper
Polyphenylene Sulfide (PPS), Glass Filled
-
240-1280-00-0602J
240-1280-00-0602J
CONN IC DIP SOCKET ZIF 40POS GLD
3M
175
In Stock
1 : ¥259.51000
Tube
Tube
Active
DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
40 (2 x 20)
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Connector
Closed Frame
Press-Fit
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Polysulfone (PSU), Glass Filled
-55°C ~ 125°C
240-1288-00-0602J
240-1288-00-0602J
CONN IC DIP SOCKET ZIF 40POS GLD
3M
79
In Stock
1 : ¥379.95000
Tube
Tube
Active
DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
40 (2 x 20)
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Connector
Closed Frame
Press-Fit
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Polysulfone (PSU), Glass Filled
-55°C ~ 125°C
224-1286-00-0602J
224-1286-00-0602J
CONN IC DIP SOCKET ZIF 24POS GLD
3M
64
In Stock
1 : ¥267.97000
Tube
Tube
Active
DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
24 (2 x 12)
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Connector
Closed Frame
Press-Fit
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Polysulfone (PSU), Glass Filled
-55°C ~ 125°C
224-5248-00-0602J
224-5248-00-0602J
CONN IC DIP SOCKET ZIF 24POS GLD
3M
86
In Stock
1 : ¥274.37000
Bulk
Bulk
Active
DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
24 (2 x 12)
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Connector
Closed Frame
Press-Fit
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Polysulfone (PSU), Glass Filled
-55°C ~ 125°C
222-3343-00-0602J
222-3343-00-0602J
CONN IC DIP SOCKET ZIF 22POS GLD
3M
66
In Stock
1 : ¥228.23000
Tube
Tube
Active
DIP, ZIF (ZIP), 0.4" (10.16mm) Row Spacing
22 (2 x 11)
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Connector
Closed Frame
Press-Fit
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Polysulfone (PSU), Glass Filled
-55°C ~ 125°C
228-1290-00-0602j
228-1290-00-0602J
CONN IC DIP SOCKET ZIF 28POS GLD
3M
13
In Stock
1 : ¥242.68000
Bulk
Bulk
Active
DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
28 (2 x 14)
0.070" (1.78mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Connector
Closed Frame
Press-Fit
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Polysulfone (PSU), Glass Filled
-55°C ~ 125°C
224-1275-00-0602J
224-1275-00-0602J
CONN IC DIP SOCKET ZIF 24POS GLD
3M
0
In Stock
Check Lead Time
1 : ¥201.47000
Tube
Tube
Active
DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
24 (2 x 12)
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Connector
Closed Frame
Press-Fit
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Polysulfone (PSU), Glass Filled
-55°C ~ 125°C
218-3341-00-0602J
218-3341-00-0602J
CONN IC DIP SOCKET ZIF 18POS GLD
3M
0
In Stock
Check Lead Time
1 : ¥208.20000
Tray
Tray
Active
DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
18 (2 x 9)
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Connector
Closed Frame
Press-Fit
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Polysulfone (PSU), Glass Filled
-55°C ~ 125°C
216-7383-55-1902
216-7383-55-1902
CONN SOCKET SOIC 16POS GOLD
3M
0
In Stock
Check Lead Time
1 : ¥335.37000
Bulk
Bulk
Active
SOIC
16 (2 x 8)
-
Gold
-
Beryllium Copper
Through Hole
Closed Frame
Solder
-
Gold
30.0µin (0.76µm)
Beryllium Copper
Polyethersulfone (PES), Glass Filled
-55°C ~ 150°C
Showing
of 15

IC Sockets


Sockets provide for repeated insertion, removal, substitution and replacement of Integrated Circuits (ICs) and transistors in a circuit. Mounting types include chassis, panel, connector, board surface and through-hole. Socket features include board guides, carriers, flanges, and open and closed framing. They are differentiated by post pitch, contact material and finish, termination style and contact finish.