IC Sockets

Results: 4
Manufacturer
Adam TechMill-Max Manufacturing Corp.On Shore Technology Inc.
Series
110ICMSA
Type
DIP, 0.3" (7.62mm) Row SpacingDIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid)
18 (2 x 9)42 (2 x 21)48 (2 x 24)
Contact Finish - Mating
GoldTin
Contact Finish Thickness - Mating
100.0µin (2.54µm)Flash
Contact Finish Thickness - Post
80.0µin (2.03µm)200.0µin (5.08µm)-
Contact Material - Post
Beryllium CopperBrassBrass Alloy
Housing Material
Polycyclohexylenedimethylene Terephthalate (PCT), PolyesterPolyphenylene Sulfide (PPS)Thermoplastic, Polyester, Glass Filled
Operating Temperature
-55°C ~ 125°C-40°C ~ 105°C
Stocking Options
Environmental Options
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Marketplace Product
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Mfr Part #
Quantity Available
Price
Series
Package
Product Status
Type
Number of Positions or Pins (Grid)
Pitch - Mating
Contact Finish - Mating
Contact Finish Thickness - Mating
Contact Material - Mating
Mounting Type
Features
Termination
Pitch - Post
Contact Finish - Post
Contact Finish Thickness - Post
Contact Material - Post
Housing Material
Operating Temperature
708
In Stock
1 : ¥11.25000
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DIP, 0.3" (7.62mm) Row Spacing
18 (2 x 9)
0.100" (2.54mm)
Tin
100.0µin (2.54µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200.0µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
ICM-642-1-GT-HT
ICM-642-1-GT-HT
MACHINE PIN SOCKET, IC, DIP, 42P
Adam Tech
445
In Stock
1 : ¥15.93000
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DIP, 0.6" (15.24mm) Row Spacing
42 (2 x 21)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Beryllium Copper
Polyphenylene Sulfide (PPS)
-40°C ~ 105°C
ICM-648-1-GT-HT
ICM-648-1-GT-HT
MACHINE PIN SOCKET, IC, DIP, 48P
Adam Tech
873
In Stock
1 : ¥20.28000
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DIP, 0.6" (15.24mm) Row Spacing
48 (2 x 24)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Beryllium Copper
Polyphenylene Sulfide (PPS)
-40°C ~ 105°C
SA486040
SA486040
CONN IC DIP SOCKET 48POS GOLD
On Shore Technology Inc.
92
In Stock
1 : ¥21.26000
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Active
DIP, 0.6" (15.24mm) Row Spacing
48 (2 x 24)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
80.0µin (2.03µm)
Brass
Thermoplastic, Polyester, Glass Filled
-40°C ~ 105°C
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of 4

IC Sockets


Sockets provide for repeated insertion, removal, substitution and replacement of Integrated Circuits (ICs) and transistors in a circuit. Mounting types include chassis, panel, connector, board surface and through-hole. Socket features include board guides, carriers, flanges, and open and closed framing. They are differentiated by post pitch, contact material and finish, termination style and contact finish.