IC Sockets

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Mfr Part #	Quantity Available	Price	Series	Package	Product Status	Type	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Mounting Type	Features	Termination	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post	Housing Material	Operating Temperature

ED14DT CONN IC DIP SOCKET 14POS TIN On Shore Technology Inc.	12,128 In Stock	1 : ¥1.81000 Tube	ED	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	14 (2 x 7)	0.100" (2.54mm)	Tin	60.0µin (1.52µm)	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	60.0µin (1.52µm)	Phosphor Bronze	Polybutylene Terephthalate (PBT), Glass Filled	-55°C ~ 110°C
ED281DT CONN IC DIP SOCKET 28POS TIN On Shore Technology Inc.	3,865 In Stock	1 : ¥3.61000 Tube	ED	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	28 (2 x 14)	0.100" (2.54mm)	Tin	60.0µin (1.52µm)	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	60.0µin (1.52µm)	Phosphor Bronze	Polybutylene Terephthalate (PBT), Glass Filled	-55°C ~ 110°C
110-43-964-41-001000 CONN IC DIP SOCKET 64POS GOLD Mill-Max Manufacturing Corp.	112 In Stock	1 : ¥67.98000 Tube	110	Tube	Active	DIP, 0.9" (22.86mm) Row Spacing	64 (2 x 32)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C

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IC Sockets

Sockets provide for repeated insertion, removal, substitution and replacement of Integrated Circuits (ICs) and transistors in a circuit. Mounting types include chassis, panel, connector, board surface and through-hole. Socket features include board guides, carriers, flanges, and open and closed framing. They are differentiated by post pitch, contact material and finish, termination style and contact finish.