Single Diodes

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Mfr Part #	Quantity Available	Price	Series	Package	Product Status	Technology	Voltage - DC Reverse (Vr) (Max)	Current - Average Rectified (Io)	Voltage - Forward (Vf) (Max) @ If	Speed	Reverse Recovery Time (trr)	Current - Reverse Leakage @ Vr	Capacitance @ Vr, F	Mounting Type	Package / Case	Supplier Device Package	Operating Temperature - Junction

MURA110T3G DIODE GEN PURP 100V 1A SMA onsemi	7,870 In Stock 10,000 Factory	1 : ¥4.02000 Cut Tape (CT) 5,000 : ¥1.04851 Tape & Reel (TR)	-	Tape & Reel (TR) Cut Tape (CT) Digi-Reel®	Active	Standard	100 V	1A	875 mV @ 1 A	Fast Recovery =< 500ns, > 200mA (Io)	30 ns	2 µA @ 100 V	-	Surface Mount	DO-214AC, SMA	SMA	-65°C ~ 175°C
MURS360BT3G DIODE GEN PURP 600V 3A SMB onsemi	54,601 In Stock	1 : ¥4.76000 Cut Tape (CT) 2,500 : ¥1.82084 Tape & Reel (TR)	-	Tape & Reel (TR) Cut Tape (CT) Digi-Reel®	Active	Standard	600 V	3A	1.25 V @ 3 A	Fast Recovery =< 500ns, > 200mA (Io)	75 ns	3 µA @ 600 V	-	Surface Mount	DO-214AA, SMB	SMB	-65°C ~ 175°C
TMMBAT42FILM DIODE SCHOTT 30V 200MA MINI MELF STMicroelectronics	28,656 In Stock	1 : ¥2.38000 Cut Tape (CT) 2,500 : ¥0.39949 Tape & Reel (TR)	-	Tape & Reel (TR) Cut Tape (CT) Digi-Reel®	Active	Schottky	30 V	200mA	1 V @ 200 mA	Small Signal =< 200mA (Io), Any Speed	5 ns	500 nA @ 25 V	7pF @ 1V, 1MHz	Surface Mount	DO-213AA (Glass)	Mini MELF	-65°C ~ 125°C
MURD320T4G DIODE GEN PURP 200V 3A DPAK onsemi	10,578 In Stock 32,500 Factory	1 : ¥6.81000 Cut Tape (CT) 2,500 : ¥2.58770 Tape & Reel (TR)	SWITCHMODE™	Tape & Reel (TR) Cut Tape (CT) Digi-Reel®	Active	Standard	200 V	3A	950 mV @ 3 A	Fast Recovery =< 500ns, > 200mA (Io)	35 ns	5 µA @ 200 V	-	Surface Mount	TO-252-3, DPAK (2 Leads + Tab), SC-63	DPAK	-65°C ~ 175°C

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Single Diodes

Products within the single rectifier diode family are used to allow current flow in one direction only, and implement exactly one instance of this function per device package. Diodes used for other purposes (including zener and variable capacitance diodes) are listed separately in product families of their own, as are products incorporating multiple diodes per device package.