Single Diodes

Results: 2
Manufacturer
Diodes IncorporatedVishay General Semiconductor - Diodes Division
Series
-SBR®
Packaging
Cut Tape (CT)Digi-Reel®Tape & Reel (TR)
Technology
SchottkySuper Barrier
Voltage - DC Reverse (Vr) (Max)
30 V40 V
Current - Average Rectified (Io)
200mA3A
Voltage - Forward (Vf) (Max) @ If
450 mV @ 15 mA470 mV @ 3 A
Speed
Fast Recovery =< 500ns, > 200mA (Io)Small Signal =< 200mA (Io), Any Speed
Current - Reverse Leakage @ Vr
500 nA @ 25 V400 µA @ 40 V
Capacitance @ Vr, F
7pF @ 1V, 1MHz-
Package / Case
POWERDI®123SOD-123
Supplier Device Package
PowerDI™ 123SOD-123
Operating Temperature - Junction
-65°C ~ 150°C125°C (Max)
Stocking Options
Environmental Options
Media
Marketplace Product
2Results

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Mfr Part #
Quantity Available
Price
Series
Package
Product Status
Technology
Voltage - DC Reverse (Vr) (Max)
Current - Average Rectified (Io)
Voltage - Forward (Vf) (Max) @ If
Speed
Reverse Recovery Time (trr)
Current - Reverse Leakage @ Vr
Capacitance @ Vr, F
Mounting Type
Package / Case
Supplier Device Package
Operating Temperature - Junction
35,136
In Stock
1 : ¥3.12000
Cut Tape (CT)
3,000 : ¥0.56156
Tape & Reel (TR)
-
Tape & Reel (TR)
Cut Tape (CT)
Digi-Reel®
Active
Schottky
30 V
200mA
450 mV @ 15 mA
Small Signal =< 200mA (Io), Any Speed
5 ns
500 nA @ 25 V
7pF @ 1V, 1MHz
Surface Mount
SOD-123
SOD-123
125°C (Max)
POWERDI123
SBR3U40P1-7
DIODE SBR 40V 3A POWERDI123
Diodes Incorporated
15,717
In Stock
1 : ¥4.60000
Cut Tape (CT)
3,000 : ¥1.55811
Tape & Reel (TR)
Tape & Reel (TR)
Cut Tape (CT)
Digi-Reel®
Active
Super Barrier
40 V
3A
470 mV @ 3 A
Fast Recovery =< 500ns, > 200mA (Io)
-
400 µA @ 40 V
-
Surface Mount
POWERDI®123
PowerDI™ 123
-65°C ~ 150°C
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Single Diodes


Products within the single rectifier diode family are used to allow current flow in one direction only, and implement exactly one instance of this function per device package. Diodes used for other purposes (including zener and variable capacitance diodes) are listed separately in product families of their own, as are products incorporating multiple diodes per device package.