Single Diodes

Results: 2
Manufacturer
Rohm SemiconductorVishay General Semiconductor - Diodes Division
Packaging
Cut Tape (CT)Digi-Reel®Tape & Reel (TR)
Technology
SchottkyStandard
Voltage - DC Reverse (Vr) (Max)
100 V300 V
Current - Average Rectified (Io)
2A30A
Voltage - Forward (Vf) (Max) @ If
860 mV @ 30 A1.1 V @ 2 A
Current - Reverse Leakage @ Vr
10 µA @ 50 V150 µA @ 100 V
Capacitance @ Vr, F
15pF @ 4V, 1MHz-
Package / Case
DO-214AA, SMBTO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Supplier Device Package
DO-214AA (SMB)TO-263L
Operating Temperature - Junction
-55°C ~ 150°C150°C
Stocking Options
Environmental Options
Media
Marketplace Product
2Results
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Mfr Part #
Quantity Available
Price
Series
Package
Product Status
Technology
Voltage - DC Reverse (Vr) (Max)
Current - Average Rectified (Io)
Voltage - Forward (Vf) (Max) @ If
Speed
Reverse Recovery Time (trr)
Current - Reverse Leakage @ Vr
Capacitance @ Vr, F
Grade
Qualification
Mounting Type
Package / Case
Supplier Device Package
Operating Temperature - Junction
11,916
In Stock
1 : ¥4.27000
Cut Tape (CT)
750 : ¥1.39632
Tape & Reel (TR)
-
Tape & Reel (TR)
Cut Tape (CT)
Active
Standard
300 V
2A
1.1 V @ 2 A
Fast Recovery =< 500ns, > 200mA (Io)
35 ns
10 µA @ 50 V
15pF @ 4V, 1MHz
Automotive
AEC-Q101
Surface Mount
DO-214AA, SMB
DO-214AA (SMB)
-55°C ~ 150°C
YQ20NL10SETL
YQ30NL10SEFHTL
TRENCH MOS STRUCTURE, 100V, 30A,
Rohm Semiconductor
974
In Stock
1 : ¥18.96000
Cut Tape (CT)
1,000 : ¥9.30598
Tape & Reel (TR)
-
Tape & Reel (TR)
Cut Tape (CT)
Digi-Reel®
Active
Schottky
100 V
30A
860 mV @ 30 A
Fast Recovery =< 500ns, > 200mA (Io)
-
150 µA @ 100 V
-
Automotive
AEC-Q101
Surface Mount
TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
TO-263L
150°C
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Single Diodes

Products within the single rectifier diode family are used to allow current flow in one direction only, and implement exactly one instance of this function per device package. Diodes used for other purposes (including zener and variable capacitance diodes) are listed separately in product families of their own, as are products incorporating multiple diodes per device package.