Single Diodes

Results: 2
Manufacturer
Comchip Technologyonsemi
Packaging
Cut Tape (CT)Digi-Reel®Tape & Reel (TR)
Technology
SchottkyStandard
Voltage - DC Reverse (Vr) (Max)
40 V80 V
Current - Average Rectified (Io)
100mA3A
Voltage - Forward (Vf) (Max) @ If
450 mV @ 3 A1.2 V @ 100 mA
Speed
Fast Recovery =< 500ns, > 200mA (Io)Small Signal =< 200mA (Io), Any Speed
Current - Reverse Leakage @ Vr
100 nA @ 80 V300 µA @ 40 V
Capacitance @ Vr, F
3pF @ 0.5V, 1MHz-
Package / Case
DO-214AC, SMASOD-723
Supplier Device Package
SMASOD-723
Operating Temperature - Junction
-55°C ~ 150°C125°C (Max)
Stocking Options
Environmental Options
Media
Marketplace Product
2Results

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Mfr Part #
Quantity Available
Price
Series
Package
Product Status
Technology
Voltage - DC Reverse (Vr) (Max)
Current - Average Rectified (Io)
Voltage - Forward (Vf) (Max) @ If
Speed
Reverse Recovery Time (trr)
Current - Reverse Leakage @ Vr
Capacitance @ Vr, F
Mounting Type
Package / Case
Supplier Device Package
Operating Temperature - Junction
SOD-723
CDSP400-G
DIODE GEN PURP 80V 100MA SOD723
Comchip Technology
694,390
In Stock
24,000
Factory
1 : ¥1.72000
Cut Tape (CT)
8,000 : ¥0.34353
Tape & Reel (TR)
-
Tape & Reel (TR)
Cut Tape (CT)
Digi-Reel®
Active
Standard
80 V
100mA
1.2 V @ 100 mA
Small Signal =< 200mA (Io), Any Speed
4 ns
100 nA @ 80 V
3pF @ 0.5V, 1MHz
Surface Mount
SOD-723
SOD-723
125°C (Max)
DO-214AC,SMA_403D−02
MBRA340T3G
DIODE SCHOTTKY 40V 3A SMA
onsemi
297,196
In Stock
1 : ¥4.84000
Cut Tape (CT)
5,000 : ¥1.56015
Tape & Reel (TR)
-
Tape & Reel (TR)
Cut Tape (CT)
Digi-Reel®
Active
Schottky
40 V
3A
450 mV @ 3 A
Fast Recovery =< 500ns, > 200mA (Io)
-
300 µA @ 40 V
-
Surface Mount
DO-214AC, SMA
SMA
-55°C ~ 150°C
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Single Diodes


Products within the single rectifier diode family are used to allow current flow in one direction only, and implement exactly one instance of this function per device package. Diodes used for other purposes (including zener and variable capacitance diodes) are listed separately in product families of their own, as are products incorporating multiple diodes per device package.