Headers, Male Pins

Results: 5
Manufacturer
MolexSamtec Inc.
Series
Milli-Grid 87831Tiger Eye™ TFM
Pitch - Mating
0.050" (1.27mm)0.079" (2.00mm)
Number of Positions
1014204080
Row Spacing - Mating
0.050" (1.27mm)0.079" (2.00mm)
Fastening Type
Latch HolderPush-Pull
Contact Length - Mating
0.131" (3.33mm)0.139" (3.53mm)0.141" (3.60mm)
Contact Length - Post
0.078" (1.98mm)0.080" (2.03mm)0.098" (2.50mm)
Insulation Height
0.220" (5.60mm)0.252" (6.40mm)0.290" (7.37mm)
Insulation Material
Liquid Crystal Polymer (LCP)Polyamide (PA), Nylon, Glass Filled
Features
Board GuideKeying SlotSolder Retention
Operating Temperature
-55°C ~ 105°C-55°C ~ 125°C
Current Rating (Amps)
2A2.9A per Contact
Voltage Rating
125V275VAC
Stocking Options
Environmental Options
Media
Marketplace Product
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Mfr Part #
Quantity Available
Price
Series
Package
Product Status
Connector Type
Contact Type
Pitch - Mating
Number of Positions
Number of Rows
Row Spacing - Mating
Number of Positions Loaded
Style
Shrouding
Mounting Type
Termination
Fastening Type
Contact Length - Mating
Contact Length - Post
Overall Contact Length
Insulation Height
Contact Shape
Contact Finish - Mating
Contact Finish Thickness - Mating
Contact Finish - Post
Contact Material
Insulation Material
Features
Operating Temperature
Ingress Protection
Material Flammability Rating
Insulation Color
Current Rating (Amps)
Voltage Rating
87831-1420
0878311420
CONN HEADER VERT 14POS 2MM
Molex
9,617
In Stock
1 : ¥21.18000
Tube
Tube
Active
Header
Male Pin
0.079" (2.00mm)
14
2
0.079" (2.00mm)
All
Board to Board or Cable
Shrouded - 4 Wall
Through Hole
Solder
Latch Holder
0.141" (3.60mm)
0.098" (2.50mm)
-
0.252" (6.40mm)
Square
Gold
15.0µin (0.38µm)
Tin
Phosphor Bronze
Polyamide (PA), Nylon, Glass Filled
Keying Slot
-55°C ~ 105°C
-
UL94 V-0
Black
2A
125V
TFM-110-01-x-D-WT
TFM-110-01-L-D-WT
CONN HEADER VERT 20POS 1.27MM
Samtec Inc.
1,097
In Stock
784
Factory
1 : ¥24.55000
Tube
Tube
Active
Header
Male Pin
0.050" (1.27mm)
20
2
0.050" (1.27mm)
All
Board to Board or Cable
Shrouded - 4 Wall
Through Hole
Solder
Push-Pull
0.131" (3.33mm)
0.078" (1.98mm)
-
0.220" (5.60mm)
Square
Gold
15.0µin (0.38µm)
Tin
Phosphor Bronze
Liquid Crystal Polymer (LCP)
Solder Retention
-55°C ~ 125°C
-
UL94 V-0
Black
2.9A per Contact
275VAC
TFM-105-01-x-D-WT
TFM-105-01-L-D-WT
CONN HEADER VERT 10POS 1.27MM
Samtec Inc.
224
In Stock
2,542
Factory
1 : ¥25.78000
Tube
Tube
Active
Header
Male Pin
0.050" (1.27mm)
10
2
0.050" (1.27mm)
All
Board to Board or Cable
Shrouded - 4 Wall
Through Hole
Solder
Push-Pull
0.131" (3.33mm)
0.078" (1.98mm)
-
0.220" (5.60mm)
Square
Gold
15.0µin (0.38µm)
Tin
Phosphor Bronze
Liquid Crystal Polymer (LCP)
Solder Retention
-55°C ~ 125°C
-
UL94 V-0
Black
2.9A per Contact
275VAC
TFM-120-01-x-D-WT
TFM-120-01-L-D-WT
CONN HEADER VERT 40POS 1.27MM
Samtec Inc.
521
In Stock
255
Factory
1 : ¥38.01000
Tube
Tube
Active
Header
Male Pin
0.050" (1.27mm)
40
2
0.050" (1.27mm)
All
Board to Board or Cable
Shrouded - 4 Wall
Through Hole
Solder
Push-Pull
0.131" (3.33mm)
0.078" (1.98mm)
-
0.220" (5.60mm)
Square
Gold
15.0µin (0.38µm)
Tin
Phosphor Bronze
Liquid Crystal Polymer (LCP)
Solder Retention
-55°C ~ 125°C
-
UL94 V-0
Black
2.9A per Contact
275VAC
CONN HEADER VERT 80POS 1.27MM
TFM-140-11-L-D-A
CONN HEADER VERT 80POS 1.27MM
Samtec Inc.
0
In Stock
Check Lead Time
1 : ¥69.21000
Tube
Tube
Active
Header
Male Pin
0.050" (1.27mm)
80
2
0.050" (1.27mm)
All
Board to Board or Cable
Shrouded - 4 Wall
Through Hole
Solder
Push-Pull
0.139" (3.53mm)
0.080" (2.03mm)
-
0.290" (7.37mm)
Square
Gold
15.0µin (0.38µm)
Tin
Phosphor Bronze
Liquid Crystal Polymer (LCP)
Board Guide
-55°C ~ 125°C
-
UL94 V-0
Black
2.9A per Contact
275VAC
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Headers, Male Pins


This type of header contains male pins within a plastic base and is meant to be mated with a rectangular cable connector or a female socket header for board-to-board connection. These come in a variety of position and pitch options, with some having a breakaway option to manually change position count with ease. Some are shrouded with 1 to 4 walls or unshrouded. Mounting types include panel mount, board edge, stacking, surface mount, and through-hole.