Headers, Male Pins

Results: 5
Manufacturer
Amphenol ICC (FCI)Molex
Series
BERGSTIK® IIC-Grid 70280KK254, 6373
Packaging
BagBulk
Connector Type
HeaderHeader, Breakaway
Number of Positions
2481036
Number of Rows
12
Row Spacing - Mating
0.100" (2.54mm)-
Style
Board to BoardBoard to Board or Cable
Shrouding
Shrouded - 1 WallUnshrouded
Fastening Type
Friction LockPush-Pull
Contact Length - Mating
0.230" (5.84mm)0.295" (7.49mm)0.320" (8.13mm)
Contact Length - Post
0.095" (2.41mm)0.110" (2.79mm)0.140" (3.56mm)
Overall Contact Length
0.425" (10.80mm)0.520" (13.21mm)0.560" (14.22mm)
Insulation Height
0.090" (2.29mm)0.100" (2.54mm)0.322" (8.18mm)
Contact Finish - Mating
GoldGold or Gold, GXT™Tin
Contact Finish Thickness - Mating
15.0µin (0.38µm)30.0µin (0.76µm)100.0µin (2.54µm)
Contact Finish - Post
-Tin
Contact Material
BrassCopper AlloyPhosphor Bronze
Insulation Material
-Liquid Crystal Polymer (LCP), Glass FilledPolyamide (PA), Nylon
Operating Temperature
-65°C ~ 125°C-
Insulation Color
BlackWhite
Current Rating (Amps)
3A per Contact-
Stocking Options
Environmental Options
Media
Marketplace Product
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Mfr Part #
Quantity Available
Price
Series
Package
Product Status
Connector Type
Contact Type
Pitch - Mating
Number of Positions
Number of Rows
Row Spacing - Mating
Number of Positions Loaded
Style
Shrouding
Mounting Type
Termination
Fastening Type
Contact Length - Mating
Contact Length - Post
Overall Contact Length
Insulation Height
Contact Shape
Contact Finish - Mating
Contact Finish Thickness - Mating
Contact Finish - Post
Contact Material
Insulation Material
Features
Operating Temperature
Ingress Protection
Material Flammability Rating
Insulation Color
Current Rating (Amps)
Voltage Rating
0022232021
0022232021
CONN HEADER VERT 2POS 2.54MM
Molex
120,488
In Stock
1 : ¥1.72000
Bulk
Bulk
Active
Header
Male Pin
0.100" (2.54mm)
2
1
-
All
Board to Board or Cable
Shrouded - 1 Wall
Through Hole
Solder
Friction Lock
0.295" (7.49mm)
0.140" (3.56mm)
0.560" (14.22mm)
0.322" (8.18mm)
Square
Tin
100.0µin (2.54µm)
Tin
Brass
Polyamide (PA), Nylon
-
-
-
UL94 V-0
White
-
-
67996-x04
67996-104HLF
CONN HEADER VERT 4POS 2.54MM
Amphenol ICC (FCI)
7,527
In Stock
1 : ¥3.53000
Bag
Bag
Active
Header
Male Pin
0.100" (2.54mm)
4
2
0.100" (2.54mm)
All
Board to Board
Unshrouded
Through Hole
Solder
Push-Pull
0.230" (5.84mm)
0.095" (2.41mm)
0.425" (10.80mm)
0.100" (2.54mm)
Square
Gold or Gold, GXT™
30.0µin (0.76µm)
-
Phosphor Bronze
-
-
-65°C ~ 125°C
-
UL94 V-0
Black
3A per Contact
-
68000-4xx
68000-410HLF
CONN HEADER VERT 10POS 2.54MM
Amphenol ICC (FCI)
1,817
In Stock
1 : ¥5.01000
Bag
Bag
Active
Header
Male Pin
0.100" (2.54mm)
10
1
-
All
Board to Board
Unshrouded
Through Hole
Solder
Push-Pull
0.230" (5.84mm)
0.095" (2.41mm)
0.425" (10.80mm)
0.100" (2.54mm)
Square
Tin
100.0µin (2.54µm)
Tin
Phosphor Bronze
-
-
-65°C ~ 125°C
-
UL94 V-0
Black
3A per Contact
-
C-Grid 70280 Series Gold
0010977086
CONN HEADER VERT 8POS 2.54MM
Molex
1,889
In Stock
1 : ¥9.19000
Bulk
Bulk
Active
Header, Breakaway
Male Pin
0.100" (2.54mm)
8
2
0.100" (2.54mm)
All
Board to Board or Cable
Unshrouded
Through Hole
Solder
Push-Pull
0.320" (8.13mm)
0.110" (2.79mm)
0.520" (13.21mm)
0.090" (2.29mm)
Square
Gold
15.0µin (0.38µm)
Tin
Copper Alloy
Liquid Crystal Polymer (LCP), Glass Filled
-
-
-
UL94 V-0
Black
-
-
67996-4xx
67996-436HLF
CONN HEADER VERT 36POS 2.54MM
Amphenol ICC (FCI)
130
In Stock
1 : ¥17.82000
Bag
Bag
Active
Header
Male Pin
0.100" (2.54mm)
36
2
0.100" (2.54mm)
All
Board to Board
Unshrouded
Through Hole
Solder
Push-Pull
0.230" (5.84mm)
0.095" (2.41mm)
0.425" (10.80mm)
0.100" (2.54mm)
Square
Tin
100.0µin (2.54µm)
Tin
Phosphor Bronze
-
-
-65°C ~ 125°C
-
UL94 V-0
Black
3A per Contact
-
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Headers, Male Pins


This type of header contains male pins within a plastic base and is meant to be mated with a rectangular cable connector or a female socket header for board-to-board connection. These come in a variety of position and pitch options, with some having a breakaway option to manually change position count with ease. Some are shrouded with 1 to 4 walls or unshrouded. Mounting types include panel mount, board edge, stacking, surface mount, and through-hole.