Arrays, Edge Type, Mezzanine (Board to Board)

Results: 2
Manufacturer
Samtec Inc.TE Connectivity AMP Connectors
Series
MICTORSEARAY™ SEAF
Packaging
Cut Tape (CT)Tape & Reel (TR)Tube
Connector Type
High Density Array, FemaleReceptacle, Center Strip Contacts
Number of Positions
38560
Pitch
0.025" (0.64mm)0.050" (1.27mm)
Number of Rows
214
Features
Board Guide, Ground Bus (Plane)Board Guide, Pick and Place
Contact Finish Thickness
10.0µin (0.25µm)30.0µin (0.76µm)
Mated Stacking Heights
6.6mm, 9mm, 10.92mm, 12.57mm, 17.96mm, 18.75mm, 20mm, 22.86mm8.5mm, 9.5mm, 10mm, 13mm, 13.5mm, 15.5mm, 17.5mm, 19.5mm
Height Above Board
0.236" (6.00mm)0.258" (6.55mm)
Stocking Options
Environmental Options
Media
Marketplace Product
2Results

Showing
of 2
Compare
Mfr Part #
Quantity Available
Price
Series
Package
Product Status
Connector Type
Number of Positions
Pitch
Number of Rows
Mounting Type
Features
Contact Finish
Contact Finish Thickness
Mated Stacking Heights
Height Above Board
2,917
In Stock
1 : ¥170.35000
Tube
Tube
Active
Receptacle, Center Strip Contacts
38
0.025" (0.64mm)
2
Surface Mount
Board Guide, Ground Bus (Plane)
Gold
30.0µin (0.76µm)
6.6mm, 9mm, 10.92mm, 12.57mm, 17.96mm, 18.75mm, 20mm, 22.86mm
0.236" (6.00mm)
SEAF-40-06.5-L-14-1-A-K-TR
SEAF-40-06.5-L-14-1-A-K-TR
CONN HD ARRAY RCPT 560P SMD GOLD
Samtec Inc.
155
In Stock
1 : ¥327.82000
Cut Tape (CT)
150 : ¥240.22053
Tape & Reel (TR)
Tape & Reel (TR)
Cut Tape (CT)
Active
High Density Array, Female
560
0.050" (1.27mm)
14
Surface Mount
Board Guide, Pick and Place
Gold
10.0µin (0.25µm)
8.5mm, 9.5mm, 10mm, 13mm, 13.5mm, 15.5mm, 17.5mm, 19.5mm
0.258" (6.55mm)
Showing
of 2

Arrays, Edge Type, Mezzanine (Board to Board)


Connectors of this type have contacts arranged in linear rows and an outline which is generally rectangular, rather than circular. They are used for creating pluggable connections directly between printed circuit boards without use of wire or cable, and can provide a large number of electrical connections in a relatively small space. For this reason they are commonly used to connect components of space-constrained systems.