Power Management - Specialized

Results: 3
Manufacturer
Diodes IncorporatedonsemiTexas Instruments
Packaging
Cut Tape (CT)Digi-Reel®Tape & Reel (TR)
Applications
Ground Fault ProtectionUSB, Type-C ConfigurationUSB, Type-C Controller
Current - Supply
575µA315mA (Max)-
Voltage - Supply
2.7V ~ 5.5V3V ~ 3.6V3V ~ 3.6V, 4.9V ~ 5.5V
Operating Temperature
-40°C ~ 125°C-40°C ~ 85°C-40°C ~ 95°C
Package / Case
12-XFQFN16-VFQFN Exposed Pad38-PowerWFQFN
Supplier Device Package
12-STQFN (1.6x1.6)16-QFN (3x3)38-WQFN (4x6)
Stocking Options
Environmental Options
Media
Marketplace Product
3Results

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of 3
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Mfr Part #
Quantity Available
Price
Series
Package
Product Status
Applications
Current - Supply
Voltage - Supply
Operating Temperature
Mounting Type
Package / Case
Supplier Device Package
TPS25750DRJKR
TPS25750DRJKR
HIGHLY INTEGRATED USB TYPE-C AND
Texas Instruments
5,307
In Stock
1 : ¥24.14000
Cut Tape (CT)
3,000 : ¥12.13105
Tape & Reel (TR)
-
Tape & Reel (TR)
Cut Tape (CT)
Digi-Reel®
Active
USB, Type-C Controller
315mA (Max)
3V ~ 3.6V, 4.9V ~ 5.5V
-40°C ~ 125°C
Surface Mount
38-PowerWFQFN
38-WQFN (4x6)
12-STQFN
PI5USB30216DXUAEX
IC PLUG IN DET TYPE C 12X2QFN
Diodes Incorporated
808
In Stock
1,193,500
Factory
1 : ¥9.35000
Cut Tape (CT)
3,500 : ¥3.96684
Tape & Reel (TR)
-
Tape & Reel (TR)
Cut Tape (CT)
Digi-Reel®
Active
USB, Type-C Configuration
-
2.7V ~ 5.5V
-40°C ~ 85°C
Surface Mount
12-XFQFN
12-STQFN (1.6x1.6)
6,104
In Stock
255,000
Factory
1 : ¥12.67000
Cut Tape (CT)
3,000 : ¥5.70984
Tape & Reel (TR)
-
Tape & Reel (TR)
Cut Tape (CT)
Digi-Reel®
Active
Ground Fault Protection
575µA
3V ~ 3.6V
-40°C ~ 95°C
Surface Mount
16-VFQFN Exposed Pad
16-QFN (3x3)
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of 3

Power Management - Specialized


Specialized power management integrated circuits (PMICs) are used for control or manipulation of electrical power in purpose specific or narrowly targeted applications such as automotive airbag management, capacitor bank balancing, monitoring of AC utility power, memory bus termination, ground fault detection, energy harvesting, small engine management, processor or chipset specific voltage regulation, load dump protection, haptic drivers, thermoelectric cooler control, and others.