Memory

Results: 2
Manufacturer
Flexxon Pte LtdRenesas Electronics Corporation
Series
-XTRA VIII
Packaging
Cut Tape (CT)Tape & Reel (TR)Tray
Product Status
ActiveNot For New Designs
Technology
FLASHFLASH - NAND (TLC)
Memory Size
16Mbit256Gbit
Memory Organization
512 Bytes x 4096 pages32G x 8
Memory Interface
eMMC_5.1SPI
Clock Frequency
85 MHz200 MHz
Write Cycle Time - Word, Page
8µs, 4ms-
Voltage - Supply
2.5V ~ 3.6V2.7V ~ 3.6V
Operating Temperature
-40°C ~ 105°C-40°C ~ 85°C (TC)
Package / Case
8-SOIC (0.154", 3.90mm Width)153-VFBGA
Supplier Device Package
8-SOIC153-FBGA (11.5x13)
Stocking Options
Environmental Options
Media
Marketplace Product
2Results
Showing
of 2
Compare
Mfr Part #
Quantity Available
Price
Series
Package
Product Status
DigiKey Programmable
Memory Type
Memory Format
Technology
Memory Size
Memory Organization
Memory Interface
Clock Frequency
Write Cycle Time - Word, Page
Voltage - Supply
Operating Temperature
Mounting Type
Package / Case
Supplier Device Package
2,524
In Stock
1 : ¥22.49000
Cut Tape (CT)
4,000 : ¥14.90004
Tape & Reel (TR)
-
Tape & Reel (TR)
Cut Tape (CT)
Not For New Designs
Not Verified
Non-Volatile
FLASH
FLASH
16Mbit
512 Bytes x 4096 pages
SPI
85 MHz
8µs, 4ms
2.5V ~ 3.6V
-40°C ~ 85°C (TC)
Surface Mount
8-SOIC (0.154", 3.90mm Width)
8-SOIC
IC FLSH 256GBIT EMMC 5.1 153FBGA
FEMC032GBB-T740
IC FLSH 256GBIT EMMC 5.1 153FBGA
Flexxon Pte Ltd
262
In Stock
1 : ¥299.08000
Tray
Tray
Active
Not Verified
Non-Volatile
FLASH
FLASH - NAND (TLC)
256Gbit
32G x 8
eMMC_5.1
200 MHz
-
2.7V ~ 3.6V
-40°C ~ 105°C
Surface Mount
153-VFBGA
153-FBGA (11.5x13)
Showing
of 2

Memory

Memory is a semiconductor device that is used as data storage device on an integrated circuit. These devices are available in several formats CBRAM, DRAM, EEPROM, EERAM, EPROM, Flash, FRAM, NVSRAM, PCM (PRAM), PSRAM, RAM, and SRAM in either Non-Volatile or Volatile. These devices memory sizes range from 64 b to 6 Tb with the interface being I2C, MMC, Parallel, eMMC, Serial, Single Wire, SPI, UFS, Xccela Bus, and 1-Wire.