Memory

Results: 2
Manufacturer
Infineon TechnologiesMicron Technology Inc.
Series
-GL-T
Packaging
Cut Tape (CT)Digi-Reel®Tape & Reel (TR)Tray
Memory Type
Non-VolatileVolatile
Memory Format
DRAMFLASH
Technology
FLASH - NORSDRAM - DDR3L
Memory Size
1Gbit4Gbit
Memory Organization
128M x 8256M x 16
Write Cycle Time - Word, Page
60ns-
Access Time
20 ns110 ns
Voltage - Supply
1.283V ~ 1.45V1.65V ~ 3.6V
Operating Temperature
-40°C ~ 85°C (TA)-40°C ~ 95°C (TC)
Package / Case
64-LBGA96-TFBGA
Supplier Device Package
64-FBGA (9x9)96-FBGA (8x14)
Stocking Options
Environmental Options
Media
Marketplace Product
2Results
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of 2
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Mfr Part #
Quantity Available
Price
Series
Package
Product Status
DigiKey Programmable
Memory Type
Memory Format
Technology
Memory Size
Memory Organization
Memory Interface
Clock Frequency
Write Cycle Time - Word, Page
Access Time
Voltage - Supply
Operating Temperature
Grade
Qualification
Mounting Type
Package / Case
Supplier Device Package
878
In Stock
1 : ¥62.80000
Cut Tape (CT)
2,000 : ¥43.53684
Tape & Reel (TR)
-
Tape & Reel (TR)
Cut Tape (CT)
Digi-Reel®
Active
Not Verified
Volatile
DRAM
SDRAM - DDR3L
4Gbit
256M x 16
Parallel
933 MHz
-
20 ns
1.283V ~ 1.45V
-40°C ~ 95°C (TC)
Automotive
AEC-Q100
Surface Mount
96-TFBGA
96-FBGA (8x14)
64-LBGA
S29GL01GT11DHIV20
IC FLASH 1GBIT PARALLEL 64FBGA
Infineon Technologies
0
In Stock
Check Lead Time
520 : ¥91.12556
Tray
Tray
Active
Not Verified
Non-Volatile
FLASH
FLASH - NOR
1Gbit
128M x 8
Parallel
-
60ns
110 ns
1.65V ~ 3.6V
-40°C ~ 85°C (TA)
-
-
Surface Mount
64-LBGA
64-FBGA (9x9)
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of 2

Memory

Memory is a semiconductor device that is used as data storage device on an integrated circuit. These devices are available in several formats CBRAM, DRAM, EEPROM, EERAM, EPROM, Flash, FRAM, NVSRAM, PCM (PRAM), PSRAM, RAM, and SRAM in either Non-Volatile or Volatile. These devices memory sizes range from 64 b to 6 Tb with the interface being I2C, MMC, Parallel, eMMC, Serial, Single Wire, SPI, UFS, Xccela Bus, and 1-Wire.