IC Sockets

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Mfr Part #	Quantity Available	Price	Series	Package	Product Status	Type	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Mounting Type	Features	Termination	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post	Housing Material	Operating Temperature

XR2A-0811-N CONN IC DIP SOCKET 8POS GOLD Omron Electronics Inc-EMC Div	493 In Stock	1 : ¥10.10000 Bulk	XR2	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Polybutylene Terephthalate (PBT), Glass Filled	-55°C ~ 125°C
XR2A-1611-N CONN IC DIP SOCKET 16POS GOLD Omron Electronics Inc-EMC Div	222 In Stock 90 Factory	1 : ¥21.10000 Bulk	XR2	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	16 (2 x 8)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Polybutylene Terephthalate (PBT), Glass Filled	-55°C ~ 125°C
XR2A-1401-N CONN IC DIP SOCKET 14POS GOLD Omron Electronics Inc-EMC Div	312 In Stock	1 : ¥22.49000 Bulk	XR2	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	14 (2 x 7)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Polybutylene Terephthalate (PBT), Glass Filled	-55°C ~ 125°C
XR2A-0825 CONN IC DIP SOCKET 8POS GOLD Omron Electronics Inc-EMC Div	134 In Stock	1 : ¥17.32000 Bulk	XR2	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Polybutylene Terephthalate (PBT), Glass Filled	-55°C ~ 125°C
XR2A-1801-N CONN IC DIP SOCKET 18POS GOLD Omron Electronics Inc-EMC Div	151 In Stock	1 : ¥25.70000 Bulk	XR2	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	18 (2 x 9)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Polybutylene Terephthalate (PBT), Glass Filled	-55°C ~ 125°C
XR2A-2411-N CONN IC DIP SOCKET 24POS GOLD Omron Electronics Inc-EMC Div	103 In Stock	1 : ¥25.94000 Bulk	XR2	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Polybutylene Terephthalate (PBT), Glass Filled	-55°C ~ 125°C
XR2A0815 CONN IC DIP SOCKET 8POS GOLD Omron Electronics Inc-EMC Div	118 In Stock	1 : ¥16.17000 Bulk	XR2	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polybutylene Terephthalate (PBT), Glass Filled	-55°C ~ 125°C
XR2A-1411-N CONN IC DIP SOCKET 14POS GOLD Omron Electronics Inc-EMC Div	73 In Stock 170 Factory	1 : ¥21.84000 Tube	XR2	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	14 (2 x 7)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Polybutylene Terephthalate (PBT), Glass Filled	-55°C ~ 125°C
XR2A-3201-N CONN IC DIP SOCKET 32POS GOLD Omron Electronics Inc-EMC Div	60 In Stock	1 : ¥37.03000 Bulk	XR2	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	32 (2 x 16)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Polybutylene Terephthalate (PBT), Glass Filled	-55°C ~ 125°C
XR2A-1625 CONN IC DIP SOCKET 16POS GOLD Omron Electronics Inc-EMC Div	0 In Stock Check Lead Time	30 : ¥27.19100 Bulk	XR2	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	16 (2 x 8)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Polybutylene Terephthalate (PBT), Glass Filled	-55°C ~ 125°C
XR2A-0802 CONN IC DIP SOCKET 8POS GOLD Omron Electronics Inc-EMC Div	36 In Stock	1 : ¥29.88000 Bulk	XR2	Bulk	Obsolete	DIP, 0.3" (7.62mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Polybutylene Terephthalate (PBT), Glass Filled	-55°C ~ 125°C
XR2A-4011-N CONN IC DIP SOCKET 40POS GOLD Omron Electronics Inc-EMC Div	12 In Stock	1 : ¥39.24000 Bulk	XR2	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	40 (2 x 20)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Polybutylene Terephthalate (PBT), Glass Filled	-55°C ~ 125°C
XR2A-1601-N IC CONNECTOR Omron Electronics Inc-EMC Div	0 In Stock Check Lead Time	30 : ¥24.08400 Bulk	*	Bulk	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
XR2A-1425 CONN IC DIP SOCKET 14POS GOLD Omron Electronics Inc-EMC Div	0 In Stock Check Lead Time	34 : ¥24.01618 Bulk	XR2	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	14 (2 x 7)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Polybutylene Terephthalate (PBT), Glass Filled	-55°C ~ 125°C
XR2A-2811-N CONN IC DIP SOCKET 28POS GOLD Omron Electronics Inc-EMC Div	0 In Stock Check Lead Time	17 : ¥35.15235 Bulk	XR2	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	28 (2 x 14)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Polybutylene Terephthalate (PBT), Glass Filled	-55°C ~ 125°C
XR2A-2471-N IC CONNECTOR Omron Electronics Inc-EMC Div	0 In Stock Check Lead Time	20 : ¥37.51600 Bulk	*	Bulk	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
XR2A-2401-N CONN IC DIP SOCKET 24POS GOLD Omron Electronics Inc-EMC Div	0 In Stock Check Lead Time	20 : ¥37.06300 Bulk	XR2	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Polybutylene Terephthalate (PBT), Glass Filled	-55°C ~ 125°C
XR2A-2025 CONN IC DIP SOCKET 20POS GOLD Omron Electronics Inc-EMC Div	0 In Stock Check Lead Time	24 : ¥40.23500 Bulk	XR2	Bulk	Active	DIP, 0.3" (7.62mm) Row Spacing	20 (2 x 10)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Polybutylene Terephthalate (PBT), Glass Filled	-55°C ~ 125°C
XR2A2201N CONN IC DIP SOCKET 22POS GOLD Omron Electronics Inc-EMC Div	0 In Stock Check Lead Time	22 : ¥40.83636 Bulk	XR2	Bulk	Active	DIP, 0.4" (10.16mm) Row Spacing	22 (2 x 11)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Brass	Polybutylene Terephthalate (PBT), Glass Filled	-55°C ~ 125°C
XR2A-3211-N CONN IC DIP SOCKET 32POS GOLD Omron Electronics Inc-EMC Div	0 In Stock Check Lead Time	15 : ¥41.78267 Bulk	XR2	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	32 (2 x 16)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Polybutylene Terephthalate (PBT), Glass Filled	-55°C ~ 125°C
XR2A-2801-N CONN IC DIP SOCKET 28POS GOLD Omron Electronics Inc-EMC Div	0 In Stock Check Lead Time	17 : ¥42.62353 Bulk	XR2	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	28 (2 x 14)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Polybutylene Terephthalate (PBT), Glass Filled	-55°C ~ 125°C
XR2A3221N CONN IC DIP SOCKET 32POS GOLD Omron Electronics Inc-EMC Div	0 In Stock Check Lead Time	15 : ¥50.81867 Bulk	XR2	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	32 (2 x 16)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polybutylene Terephthalate (PBT), Glass Filled	-55°C ~ 125°C
XR2A-4001-N CONN IC DIP SOCKET 40POS GOLD Omron Electronics Inc-EMC Div	0 In Stock Check Lead Time	12 : ¥56.23750 Bulk	XR2	Bulk	Active	DIP, 0.6" (15.24mm) Row Spacing	40 (2 x 20)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Polybutylene Terephthalate (PBT), Glass Filled	-55°C ~ 125°C
XR2A-6411-N I.C. CONNECTOR SOCKET Omron Electronics Inc-EMC Div	0 In Stock Check Lead Time	10 : ¥72.27700 Bulk	*	Bulk	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
XR2A-2001-N CONN IC DIP SOCKET 20POS GOLD Omron Electronics Inc-EMC Div	0 In Stock	Obsolete	XR2	Bulk	Obsolete	DIP, 0.3" (7.62mm) Row Spacing	20 (2 x 10)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Polybutylene Terephthalate (PBT), Glass Filled	-55°C ~ 125°C

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Sockets provide for repeated insertion, removal, substitution and replacement of Integrated Circuits (ICs) and transistors in a circuit. Mounting types include chassis, panel, connector, board surface and through-hole. Socket features include board guides, carriers, flanges, and open and closed framing. They are differentiated by post pitch, contact material and finish, termination style and contact finish.

IC Sockets

IC Sockets

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