IC Sockets

Results: 4
Manufacturer
3MAdam Tech
Series
4800ICS
Number of Positions or Pins (Grid)
8 (2 x 4)16 (2 x 8)28 (2 x 14)
Contact Finish Thickness - Mating
35.4µin (0.90µm)-
Contact Finish Thickness - Post
35.0µin (0.90µm)-
Housing Material
Polybutylene Terephthalate (PBT), Glass FilledPolyester, Glass Filled
Operating Temperature
-55°C ~ 105°C-25°C ~ 85°C
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Mfr Part #
Quantity Available
Price
Series
Package
Product Status
Type
Number of Positions or Pins (Grid)
Pitch - Mating
Contact Finish - Mating
Contact Finish Thickness - Mating
Contact Material - Mating
Mounting Type
Features
Termination
Pitch - Post
Contact Finish - Post
Contact Finish Thickness - Post
Contact Material - Post
Housing Material
Operating Temperature
ICS-308-T
ICS-308-T
IC SOCKET, DIP, 8P 2.54MM PITCH
Adam Tech
11,123
In Stock
1 : ¥1.31000
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DIP, 0.3" (7.62mm) Row Spacing
8 (2 x 4)
0.100" (2.54mm)
Tin
-
Phosphor Bronze
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Phosphor Bronze
Polybutylene Terephthalate (PBT), Glass Filled
-55°C ~ 105°C
ICS-316-T
ICS-316-T
IC SOCKET, DIP, 16P 2.54MM PITCH
Adam Tech
8,019
In Stock
1 : ¥1.64000
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DIP, 0.3" (7.62mm) Row Spacing
16 (2 x 8)
0.100" (2.54mm)
Tin
-
Phosphor Bronze
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Phosphor Bronze
Polybutylene Terephthalate (PBT), Glass Filled
-55°C ~ 105°C
4816-3000-CP
4816-3000-CP
CONN IC DIP SOCKET 16POS TIN
3M
12,223
In Stock
1 : ¥5.83000
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DIP, 0.3" (7.62mm) Row Spacing
16 (2 x 8)
0.100" (2.54mm)
Tin
35.4µin (0.90µm)
Phosphor Bronze
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
35.0µin (0.90µm)
Phosphor Bronze
Polyester, Glass Filled
-25°C ~ 85°C
4828-3004-CP
4828-3004-CP
CONN IC DIP SOCKET 28POS TIN
3M
11,545
In Stock
1 : ¥8.70000
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Active
DIP, 0.3" (7.62mm) Row Spacing
28 (2 x 14)
0.100" (2.54mm)
Tin
35.4µin (0.90µm)
Phosphor Bronze
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
35.0µin (0.90µm)
Phosphor Bronze
Polyester, Glass Filled
-25°C ~ 85°C
Showing
of 4

IC Sockets


Sockets provide for repeated insertion, removal, substitution and replacement of Integrated Circuits (ICs) and transistors in a circuit. Mounting types include chassis, panel, connector, board surface and through-hole. Socket features include board guides, carriers, flanges, and open and closed framing. They are differentiated by post pitch, contact material and finish, termination style and contact finish.