IC Sockets

Results: 5
Manufacturer
Assmann WSW ComponentsTE Connectivity AMP Connectors
Series
-Diplomate DL
Type
DIP, 0.3" (7.62mm) Row SpacingDIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid)
14 (2 x 7)20 (2 x 10)24 (2 x 12)28 (2 x 14)40 (2 x 20)
Contact Finish Thickness - Mating
60.0µin (1.52µm)-
Contact Finish Thickness - Post
60.0µin (1.52µm)-
Contact Material - Post
Brass, CopperNickelPhosphor Bronze
Housing Material
Polybutylene Terephthalate (PBT)Polybutylene Terephthalate (PBT), Glass Filled
Operating Temperature
-55°C ~ 85°C-40°C ~ 105°C
Stocking Options
Environmental Options
Media
Marketplace Product
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Mfr Part #
Quantity Available
Price
Series
Package
Product Status
Type
Number of Positions or Pins (Grid)
Pitch - Mating
Contact Finish - Mating
Contact Finish Thickness - Mating
Contact Material - Mating
Mounting Type
Features
Termination
Pitch - Post
Contact Finish - Post
Contact Finish Thickness - Post
Contact Material - Post
Housing Material
Operating Temperature
1-2199298-3
1-2199298-3
CONN IC DIP SOCKET 14POS TIN
TE Connectivity AMP Connectors
5,089
In Stock
1 : ¥1.72000
Tube
Tube
Active
DIP, 0.3" (7.62mm) Row Spacing
14 (2 x 7)
0.100" (2.54mm)
Tin
60.0µin (1.52µm)
Phosphor Bronze
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass, Copper
Polybutylene Terephthalate (PBT), Glass Filled
-40°C ~ 105°C
A24-LC-TT-(R)
A 24-LC-TT
CONN IC DIP SOCKET 24POS TIN
Assmann WSW Components
3,752
In Stock
1,780
Factory
1 : ¥3.69000
Tube
-
Tube
Active
DIP, 0.6" (15.24mm) Row Spacing
24 (2 x 12)
0.100" (2.54mm)
Tin
-
Phosphor Bronze
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Phosphor Bronze
Polybutylene Terephthalate (PBT)
-55°C ~ 85°C
A28-LC-TT-(R)
A 28-LC-TT
CONN IC DIP SOCKET 28POS TIN
Assmann WSW Components
1,535
In Stock
1 : ¥3.69000
Tube
-
Tube
Active
DIP, 0.6" (15.24mm) Row Spacing
28 (2 x 14)
0.100" (2.54mm)
Tin
-
Phosphor Bronze
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Phosphor Bronze
Polybutylene Terephthalate (PBT)
-55°C ~ 85°C
1-2199298-6
1-2199298-6
CONN IC DIP SOCKET 20POS TIN
TE Connectivity AMP Connectors
3,881
In Stock
1 : ¥3.86000
Tube
Tube
Active
DIP, 0.3" (7.62mm) Row Spacing
20 (2 x 10)
0.100" (2.54mm)
Tin
60.0µin (1.52µm)
Phosphor Bronze
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass, Copper
Polybutylene Terephthalate (PBT), Glass Filled
-40°C ~ 105°C
1-2199299-5
1-2199299-5
40P,DIP SKT,600 CL,LDR,PB FREE
TE Connectivity AMP Connectors
966
In Stock
1 : ¥7.88000
Tube
Tube
Active
DIP, 0.6" (15.24mm) Row Spacing
40 (2 x 20)
0.100" (2.54mm)
Tin
60.0µin (1.52µm)
Phosphor Bronze
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
60.0µin (1.52µm)
Nickel
Polybutylene Terephthalate (PBT), Glass Filled
-40°C ~ 105°C
Showing
of 5

IC Sockets


Sockets provide for repeated insertion, removal, substitution and replacement of Integrated Circuits (ICs) and transistors in a circuit. Mounting types include chassis, panel, connector, board surface and through-hole. Socket features include board guides, carriers, flanges, and open and closed framing. They are differentiated by post pitch, contact material and finish, termination style and contact finish.