IC Sockets

Results: 5
Manufacturer
3MMill-Max Manufacturing Corp.
Series
11048008400
Type
DIP, 0.6" (15.24mm) Row SpacingDIP, 0.9" (22.86mm) Row SpacingPLCC
Number of Positions or Pins (Grid)
40 (2 x 20)48 (2 x 24)64 (2 x 32)84 (4 x 21)
Pitch - Mating
0.050" (1.27mm)0.100" (2.54mm)
Contact Finish - Mating
TinTin-Lead
Contact Finish Thickness - Mating
35.4µin (0.90µm)100.0µin (2.54µm)160.0µin (4.06µm)200.0µin (5.08µm)
Contact Material - Mating
Beryllium CopperCopper AlloyPhosphor Bronze
Features
Closed FrameOpen Frame
Contact Finish - Post
TinTin-Lead
Contact Finish Thickness - Post
35.0µin (0.90µm)160.0µin (4.06µm)200.0µin (5.08µm)
Contact Material - Post
Brass AlloyCopper AlloyPhosphor Bronze
Housing Material
Polybutylene Terephthalate (PBT), Glass FilledPolycyclohexylenedimethylene Terephthalate (PCT), PolyesterPolyester, Glass Filled
Operating Temperature
-55°C ~ 125°C-40°C ~ 105°C-25°C ~ 85°C
Stocking Options
Environmental Options
Media
Marketplace Product
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Mfr Part #
Quantity Available
Price
Series
Package
Product Status
Type
Number of Positions or Pins (Grid)
Pitch - Mating
Contact Finish - Mating
Contact Finish Thickness - Mating
Contact Material - Mating
Mounting Type
Features
Termination
Pitch - Post
Contact Finish - Post
Contact Finish Thickness - Post
Contact Material - Post
Housing Material
Operating Temperature
4840-6004-CP
4840-6004-CP
CONN IC DIP SOCKET 40POS TIN
3M
3,062
In Stock
1 : ¥10.84000
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DIP, 0.6" (15.24mm) Row Spacing
40 (2 x 20)
0.100" (2.54mm)
Tin
35.4µin (0.90µm)
Phosphor Bronze
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
35.0µin (0.90µm)
Phosphor Bronze
Polyester, Glass Filled
-25°C ~ 85°C
4848-6000-cp
4848-6000-CP
CONN IC DIP SOCKET 48POS TIN
3M
309
In Stock
1 : ¥11.82000
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DIP, 0.6" (15.24mm) Row Spacing
48 (2 x 24)
0.100" (2.54mm)
Tin
35.4µin (0.90µm)
Phosphor Bronze
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
35.0µin (0.90µm)
Phosphor Bronze
Polyester, Glass Filled
-25°C ~ 85°C
191
In Stock
1 : ¥25.78000
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Tube
Active
DIP, 0.6" (15.24mm) Row Spacing
48 (2 x 24)
0.100" (2.54mm)
Tin
100.0µin (2.54µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200.0µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
8484-11B1-RK-TP
8484-11B1-RK-TP
CONN SOCKET PLCC 84POS TIN
3M
869
In Stock
1 : ¥28.41000
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Tube
Active
PLCC
84 (4 x 21)
0.050" (1.27mm)
Tin
160.0µin (4.06µm)
Copper Alloy
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin
160.0µin (4.06µm)
Copper Alloy
Polybutylene Terephthalate (PBT), Glass Filled
-40°C ~ 105°C
110 Series 64 POS
110-99-964-41-001000
CONN IC DIP SOCKET 64POS TINLEAD
Mill-Max Manufacturing Corp.
48
In Stock
1 : ¥44.25000
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Active
DIP, 0.9" (22.86mm) Row Spacing
64 (2 x 32)
0.100" (2.54mm)
Tin-Lead
200.0µin (5.08µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin-Lead
200.0µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
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IC Sockets


Sockets provide for repeated insertion, removal, substitution and replacement of Integrated Circuits (ICs) and transistors in a circuit. Mounting types include chassis, panel, connector, board surface and through-hole. Socket features include board guides, carriers, flanges, and open and closed framing. They are differentiated by post pitch, contact material and finish, termination style and contact finish.