Heat Sinks

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Mfr Part #	Quantity Available	Price	Series	Package	Product Status	Type	Package Cooled	Attachment Method	Shape	Length	Width	Diameter	Fin Height	Power Dissipation @ Temperature Rise	Thermal Resistance @ Forced Air Flow	Thermal Resistance @ Natural	Material	Material Finish

507302B00000G HEATSINK TO-220 2.5W LOW PROFILE Boyd Laconia, LLC	1,421 In Stock	1 : ¥8.13000 Bulk	-	Bulk	Active	Board Level	TO-220	Bolt On	Square, Fins	0.750" (19.05mm)	0.750" (19.05mm)	-	0.380" (9.65mm)	2.5W @ 60°C	10.00°C/W @ 200 LFM	24.00°C/W	Aluminum	Black Anodized
HSB05-171711 HEAT SINK, BGA, 17 X 17 X 11.5 M CUI Devices	6,400 In Stock	1 : ¥8.87000 Box	HSB	Box	Active	Top Mount	BGA	Adhesive (Not Included)	Square, Pin Fins	0.669" (17.00mm)	0.669" (17.00mm)	-	0.453" (11.50mm)	3.1W @ 75°C	8.40°C/W @ 200 LFM	23.91°C/W	Aluminum Alloy	Black Anodized
HSE-B2111-038 HEAT SINK, EXTRUSION, TO-220, 25 CUI Devices	13,659 In Stock	1 : ¥2.55000 Box	HSE	Box	Active	Board Level	TO-220	Bolt On	Rectangular, Fins	0.984" (25.00mm)	0.625" (16.00mm)	-	0.354" (9.00mm)	3.8W @ 75°C	6.12°C/W @ 200 LFM	19.74°C/W	Aluminum Alloy	Black Anodized
V2022B HEATSINK CPU XCUT Assmann WSW Components	3,923 In Stock	1 : ¥4.84000 Bulk	-	Bulk	Active	Top Mount	Assorted (BGA, LGA, CPU, ASIC...)	Thermal Tape, Adhesive (Not Included)	Square, Pin Fins	0.827" (21.00mm)	0.827" (21.00mm)	-	0.236" (6.00mm)	-	-	24.00°C/W	Aluminum Alloy	Black Anodized
V2026B HEATSINK CPU XCUT Assmann WSW Components	2,638 In Stock 1,560 Factory	1 : ¥5.66000 Bulk	-	Bulk	Active	Top Mount	Assorted (BGA, LGA, CPU, ASIC...)	Thermal Tape, Adhesive (Not Included)	Square, Pin Fins	1.063" (27.00mm)	1.063" (27.00mm)	-	0.236" (6.00mm)	-	-	20.00°C/W	Aluminum Alloy	Black Anodized
HSB07-202009 HEAT SINK, BGA, 20 X 20 X 9 MM CUI Devices	1,755 In Stock	1 : ¥6.90000 Box	HSB	Box	Active	Top Mount	BGA	Adhesive (Not Included)	Square, Pin Fins	0.787" (20.00mm)	0.787" (20.00mm)	-	0.354" (9.00mm)	3.1W @ 75°C	8.60°C/W @ 200 LFM	24.08°C/W	Aluminum Alloy	Black Anodized
HSB26-343408 HEAT SINK, BGA, 33.5 X 33.5 X 8 CUI Devices	648 In Stock	1 : ¥9.36000 Box	HSB	Box	Active	Top Mount	BGA	Adhesive (Not Included)	Square, Pin Fins	1.319" (33.50mm)	1.319" (33.50mm)	-	0.315" (8.00mm)	4.94W @ 75°C	5.30°C/W @ 200 LFM	15.19°C/W	Aluminum Alloy	Black Anodized
HSB21-454515 HEAT SINK, BGA, 45 X 45 X 15 MM CUI Devices	887 In Stock	1 : ¥17.49000 Box	HSB	Box	Active	Top Mount	BGA	Adhesive (Not Included)	Square, Pin Fins	1.772" (45.00mm)	1.772" (45.00mm)	-	0.591" (15.00mm)	9.9W @ 75°C	2.80°C/W @ 200 LFM	7.56°C/W	Aluminum Alloy	Black Anodized
628-40AB HEATSINK CPU 43MM SQ BLK H=.4" Wakefield-Vette	3,566 In Stock	1 : ¥20.36000 Bulk	628	Bulk	Active	Top Mount	Assorted (BGA, LGA, CPU, ASIC...)	Thermal Tape, Adhesive (Not Included)	Square, Pin Fins	1.750" (44.45mm)	1.700" (43.18mm)	-	0.400" (10.16mm)	2.5W @ 30°C	4.00°C/W @ 300 LFM	-	Aluminum	Black Anodized
658-45ABT4E HEATSINK CPU 28MM SQ BLK W/TAPE Wakefield-Vette	273 In Stock	1 : ¥30.38000 Bulk	658	Bulk	Active	Top Mount	BGA	Thermal Tape, Adhesive (Included)	Square, Pin Fins	1.100" (27.94mm)	1.100" (27.94mm)	-	0.450" (11.43mm)	3.0W @ 50°C	6.00°C/W @ 200 LFM	-	Aluminum	Black Anodized
HSB25-282810 HEAT SINK, BGA, 28.5 X 28.5 X 10 CUI Devices	4 In Stock	1 : ¥10.67000 Box	HSB	Box	Active	Top Mount	BGA	Push Pin	Square, Pin Fins	1.122" (28.50mm)	1.122" (28.50mm)	-	0.394" (10.00mm)	4.87W @ 75°C	5.10°C/W @ 200 LFM	15.41°C/W	Aluminum Alloy	Black Anodized

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Heat Sinks

Passive heat exchangers that transfer the heat generated by an electronic component to a fluid medium, often air or a liquid coolant, dissipating it away from the device to maintain an optimal operating temperature. They are designed to maximize the surface area in contact with the medium surrounding it. They are usually made out of copper or aluminum due to their high thermal conductivity.