Heat Sinks

Results: 2
Manufacturer
Boyd Laconia, LLCCTS Thermal Management Products
Series
-APF
Packaging
BoxBulk
Type
Board Level, VerticalTop Mount
Package Cooled
Assorted (BGA, LGA, CPU, ASIC...)TO-218, TO-220, TO-247, Multiwatt
Attachment Method
Bolt On and PC PinThermal Tape, Adhesive (Included)
Shape
Rectangular, FinsSquare, Fins
Length
1.181" (30.00mm)2.000" (50.80mm)
Width
1.181" (30.00mm)1.650" (41.91mm)
Fin Height
0.500" (12.70mm)1.000" (25.40mm)
Power Dissipation @ Temperature Rise
8.0W @ 40°C-
Thermal Resistance @ Forced Air Flow
1.00°C/W @ 700 LFM2.50°C/W @ 200 LFM
Thermal Resistance @ Natural
3.30°C/W-
Stocking Options
Environmental Options
Media
Marketplace Product
2Results
Showing
of 2
Compare
Mfr Part #
Quantity Available
Price
Series
Package
Product Status
Type
Package Cooled
Attachment Method
Shape
Length
Width
Diameter
Fin Height
Power Dissipation @ Temperature Rise
Thermal Resistance @ Forced Air Flow
Thermal Resistance @ Natural
Material
Material Finish
521
In Stock
1 : ¥72.16000
Bulk
-
Bulk
Active
Board Level, Vertical
TO-218, TO-220, TO-247, Multiwatt
Bolt On and PC Pin
Rectangular, Fins
2.000" (50.80mm)
1.650" (41.91mm)
-
1.000" (25.40mm)
8.0W @ 40°C
1.00°C/W @ 700 LFM
3.30°C/W
Aluminum
Black Anodized
0
In Stock
Check Lead Time
1 : ¥67.48000
Box
Box
Active
Top Mount
Assorted (BGA, LGA, CPU, ASIC...)
Thermal Tape, Adhesive (Included)
Square, Fins
1.181" (30.00mm)
1.181" (30.00mm)
-
0.500" (12.70mm)
-
2.50°C/W @ 200 LFM
-
Aluminum
Black Anodized
Showing
of 2

Heat Sinks

Passive heat exchangers that transfer the heat generated by an electronic component to a fluid medium, often air or a liquid coolant, dissipating it away from the device to maintain an optimal operating temperature. They are designed to maximize the surface area in contact with the medium surrounding it. They are usually made out of copper or aluminum due to their high thermal conductivity.