Heat Sinks

Results: 2
Manufacturer
Advanced Thermal Solutions Inc.Ohmite
Series
pushPIN™R
Packaging
BoxBulk
Type
Board Level, VerticalTop Mount
Package Cooled
Assorted (BGA, LGA, CPU, ASIC...)TO-218, TO-220, TO-247
Attachment Method
Bolt On and PC PinPush Pin
Shape
Rectangular, FinsSquare, Fins
Length
0.984" (25.00mm)1.654" (42.00mm)
Width
0.984" (25.00mm)0.985" (25.00mm)
Fin Height
0.590" (15.00mm)1.000" (25.40mm)
Power Dissipation @ Temperature Rise
2.0W @ 20°C-
Thermal Resistance @ Forced Air Flow
1.50°C/W @ 200 LFM12.18°C/W @ 100 LFM
Thermal Resistance @ Natural
4.80°C/W-
Material Finish
Black AnodizedBlue Anodized
Stocking Options
Environmental Options
Media
Marketplace Product
2Results
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of 2
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Mfr Part #
Quantity Available
Price
Series
Package
Product Status
Type
Package Cooled
Attachment Method
Shape
Length
Width
Diameter
Fin Height
Power Dissipation @ Temperature Rise
Thermal Resistance @ Forced Air Flow
Thermal Resistance @ Natural
Material
Material Finish
RA-T2X-25E
RA-T2X-25E
HEATSINK TO-218,TO-220,TO-247
Ohmite
2,437
In Stock
1 : ¥17.16000
Box
Box
Active
Board Level, Vertical
TO-218, TO-220, TO-247
Bolt On and PC Pin
Rectangular, Fins
1.654" (42.00mm)
0.985" (25.00mm)
-
1.000" (25.40mm)
2.0W @ 20°C
1.50°C/W @ 200 LFM
4.80°C/W
Aluminum
Black Anodized
1,855
In Stock
1 : ¥26.93000
Bulk
Bulk
Active
Top Mount
Assorted (BGA, LGA, CPU, ASIC...)
Push Pin
Square, Fins
0.984" (25.00mm)
0.984" (25.00mm)
-
0.590" (15.00mm)
-
12.18°C/W @ 100 LFM
-
Aluminum
Blue Anodized
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of 2

Heat Sinks

Passive heat exchangers that transfer the heat generated by an electronic component to a fluid medium, often air or a liquid coolant, dissipating it away from the device to maintain an optimal operating temperature. They are designed to maximize the surface area in contact with the medium surrounding it. They are usually made out of copper or aluminum due to their high thermal conductivity.