Heat Sinks

Results: 2
Series
-pushPIN™
Packaging
BulkTray
Type
Top MountTop Mount, Extrusion
Package Cooled
-Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method
AdhesivePush Pin
Shape
Rectangular, FinsSquare, Fins
Length
1.378" (35.00mm)11.811" (300.00mm)
Width
0.236" (6.00mm)1.378" (35.00mm)
Fin Height
0.315" (8.00mm)0.984" (25.00mm)
Thermal Resistance @ Forced Air Flow
4.78°C/W @ 100 LFM45.00°C/W @ 200 LFM
Thermal Resistance @ Natural
65.00°C/W-
Material Finish
Blue AnodizedDegreased
Stocking Options
Environmental Options
Media
Marketplace Product
2Results
Showing
of 2
Compare
Mfr Part #
Quantity Available
Price
Series
Package
Product Status
Type
Package Cooled
Attachment Method
Shape
Length
Width
Diameter
Fin Height
Power Dissipation @ Temperature Rise
Thermal Resistance @ Forced Air Flow
Thermal Resistance @ Natural
Material
Material Finish
112
In Stock
1 : ¥77.91000
Bulk
-
Bulk
Active
Top Mount, Extrusion
-
Adhesive
Rectangular, Fins
11.811" (300.00mm)
0.236" (6.00mm)
-
0.315" (8.00mm)
-
45.00°C/W @ 200 LFM
65.00°C/W
Aluminum
Degreased
86
In Stock
1 : ¥22.00000
Tray
Tray
Active
Top Mount
Assorted (BGA, LGA, CPU, ASIC...)
Push Pin
Square, Fins
1.378" (35.00mm)
1.378" (35.00mm)
-
0.984" (25.00mm)
-
4.78°C/W @ 100 LFM
-
Aluminum
Blue Anodized
Showing
of 2

Heat Sinks

Passive heat exchangers that transfer the heat generated by an electronic component to a fluid medium, often air or a liquid coolant, dissipating it away from the device to maintain an optimal operating temperature. They are designed to maximize the surface area in contact with the medium surrounding it. They are usually made out of copper or aluminum due to their high thermal conductivity.