Heat Sinks

Results: 5
Manufacturer
Assmann WSW ComponentsCTS Thermal Management ProductsCUI DevicesWakefield-Vette
Series
-624658BDNHSB
Packaging
BoxBulk
Package Cooled
14-DIP and 16-DIPAssorted (BGA, LGA, CPU, ASIC...)BGA
Attachment Method
Adhesive (Not Included)Press FitThermal Tape, Adhesive (Included)Thermal Tape, Adhesive (Not Included)
Shape
Rectangular, FinsSquare, Pin Fins
Length
0.250" (6.35mm)0.827" (21.00mm)0.906" (23.00mm)0.910" (23.11mm)1.100" (27.94mm)
Width
0.748" (19.00mm)0.827" (21.00mm)0.906" (23.00mm)0.910" (23.11mm)1.100" (27.94mm)
Fin Height
0.190" (4.83mm)0.355" (9.02mm)0.394" (10.00mm)0.450" (11.43mm)0.600" (15.24mm)
Power Dissipation @ Temperature Rise
2.5W @ 30°C3.7W @ 75°C-
Thermal Resistance @ Forced Air Flow
2.00°C/W @ 500 LFM6.80°C/W @ 200 LFM9.60°C/W @ 400 LFM15.00°C/W @ 200 LFM-
Thermal Resistance @ Natural
20.41°C/W26.90°C/W48.00°C/W-
Material
AluminumAluminum Alloy
Stocking Options
Environmental Options
Media
Marketplace Product
5Results
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Mfr Part #
Quantity Available
Price
Series
Package
Product Status
Type
Package Cooled
Attachment Method
Shape
Length
Width
Diameter
Fin Height
Power Dissipation @ Temperature Rise
Thermal Resistance @ Forced Air Flow
Thermal Resistance @ Natural
Material
Material Finish
658-60ABT1E
658-60ABT1E
HEATSINK CPU 28MM SQ BLK W/TAPE
Wakefield-Vette
19,607
In Stock
1 : ¥30.13000
Bulk
Bulk
Active
Top Mount
BGA
Thermal Tape, Adhesive (Included)
Square, Pin Fins
1.100" (27.94mm)
1.100" (27.94mm)
-
0.600" (15.24mm)
2.5W @ 30°C
2.00°C/W @ 500 LFM
-
Aluminum
Black Anodized
6,910
In Stock
1 : ¥2.96000
Bulk
-
Bulk
Active
Top Mount
14-DIP and 16-DIP
Press Fit
Rectangular, Fins
0.250" (6.35mm)
0.748" (19.00mm)
-
0.190" (4.83mm)
-
-
48.00°C/W
Aluminum
Black Anodized
HSB18-232310
HSB18-232310
HEAT SINK, BGA, 23 X 23 X 10 MM
CUI Devices
4,468
In Stock
1 : ¥5.99000
Box
Box
Active
Top Mount
BGA
Adhesive (Not Included)
Square, Pin Fins
0.906" (23.00mm)
0.906" (23.00mm)
-
0.394" (10.00mm)
3.7W @ 75°C
6.80°C/W @ 200 LFM
20.41°C/W
Aluminum Alloy
Black Anodized
624-45ABT3
624-45ABT3
HEATSINK CPU 21MM SQ W/ADH BLK
Wakefield-Vette
15,738
In Stock
1 : ¥25.20000
Bulk
Bulk
Active
Top Mount
BGA
Thermal Tape, Adhesive (Included)
Square, Pin Fins
0.827" (21.00mm)
0.827" (21.00mm)
-
0.450" (11.43mm)
-
15.00°C/W @ 200 LFM
-
Aluminum
Black Anodized
417
In Stock
1 : ¥7.96000
Box
Box
Active
Top Mount
Assorted (BGA, LGA, CPU, ASIC...)
Thermal Tape, Adhesive (Not Included)
Square, Pin Fins
0.910" (23.11mm)
0.910" (23.11mm)
-
0.355" (9.02mm)
-
9.60°C/W @ 400 LFM
26.90°C/W
Aluminum
Black Anodized
Showing
of 5

Heat Sinks

Passive heat exchangers that transfer the heat generated by an electronic component to a fluid medium, often air or a liquid coolant, dissipating it away from the device to maintain an optimal operating temperature. They are designed to maximize the surface area in contact with the medium surrounding it. They are usually made out of copper or aluminum due to their high thermal conductivity.