Headers, Receptacles, Female Sockets

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Mfr Part #	Quantity Available	Price	Series	Package	Product Status	Connector Type	Contact Type	Style	Number of Positions	Number of Positions Loaded	Pitch - Mating	Number of Rows	Row Spacing - Mating	Mounting Type	Termination	Fastening Type	Contact Finish - Mating	Contact Finish Thickness - Mating	Insulation Color	Insulation Height	Contact Length - Post	Operating Temperature	Material Flammability Rating	Contact Finish - Post	Mated Stacking Heights	Ingress Protection	Features	Current Rating (Amps)	Voltage Rating

ESW-103-33-G-D-LL CONN SOCKET 6POS 0.1 GOLD PCB Samtec Inc.	0 In Stock 135 Factory Check Lead Time	1 : ¥27.75000 Bulk	ESW	Bulk	Active	Elevated Socket	Forked	Board to Board	6	All	0.100" (2.54mm)	2	0.100" (2.54mm)	Through Hole	Kinked Pin, Solder	Push-Pull	Gold	20.0µin (0.51µm)	Black	0.635" (16.13mm)	0.090" (2.29mm)	-55°C ~ 125°C	UL94 V-0	Gold	-	-	-	5.2A per Contact	550VAC
ESW-105-33-G-D-LL CONN SOCKET 10POS 0.1 GOLD PCB Samtec Inc.	0 In Stock 118 Factory Check Lead Time	1 : ¥35.06000 Bulk	ESW	Bulk	Active	Elevated Socket	Forked	Board to Board	10	All	0.100" (2.54mm)	2	0.100" (2.54mm)	Through Hole	Kinked Pin, Solder	Push-Pull	Gold	20.0µin (0.51µm)	Black	0.635" (16.13mm)	0.090" (2.29mm)	-55°C ~ 125°C	UL94 V-0	Gold	-	-	-	5.2A per Contact	550VAC
ESW-118-33-G-D-LL CONN SOCKET 36POS 0.1 GOLD PCB Samtec Inc.	0 In Stock 56 Factory Check Lead Time	12 : ¥85.55333 Bulk	ESW	Bulk	Active	Elevated Socket	Forked	Board to Board	36	All	0.100" (2.54mm)	2	0.100" (2.54mm)	Through Hole	Kinked Pin, Solder	Push-Pull	Gold	20.0µin (0.51µm)	Black	0.635" (16.13mm)	0.090" (2.29mm)	-55°C ~ 125°C	UL94 V-0	Gold	-	-	-	5.2A per Contact	550VAC

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This type of header (receptacle) contains female sockets within a plastic housing and is meant to be mated with a rectangular cable connector or a male pin header for board-to-board connection. These come in a variety of position and pitch options, with some having a breakaway option to manually change position count with ease. Mounting types include panel mount, board edge, stacking, surface mount, and through-hole.