Headers, Male Pins

Results: 5
Manufacturer
Amphenol ICC (FCI)CNC TechMolex
Series
-BERGSTIK®Micro-Fit 3.0 43045Micro-Fit 3.0 43650
Packaging
BagBulkTray
Pitch - Mating
0.098" (2.50mm)0.100" (2.54mm)0.118" (3.00mm)
Number of Positions
3458
Number of Rows
12
Row Spacing - Mating
0.118" (3.00mm)-
Style
Board to BoardBoard to Cable/Wire
Shrouding
Shrouded - 4 WallUnshrouded
Termination
Kinked Pin, SolderSolder
Fastening Type
Detent LockLocking RampPush-Pull
Contact Length - Mating
0.230" (5.84mm)-
Contact Length - Post
0.120" (3.05mm)0.125" (3.18mm)0.134" (3.40mm)
Overall Contact Length
0.450" (11.43mm)-
Insulation Height
0.100" (2.54mm)0.276" (7.00mm)0.390" (9.91mm)
Contact Finish - Mating
Gold or Gold, GXT™Tin
Contact Finish Thickness - Mating
30.0µin (0.76µm)100.0µin (2.54µm)-
Contact Material
BrassPhosphor Bronze
Insulation Material
Liquid Crystal Polymer (LCP), Glass FilledPolyamide (PA66), Nylon 6/6Thermoplastic
Features
-Board Guide
Operating Temperature
-65°C ~ 125°C-40°C ~ 105°C-25°C ~ 85°C-
Insulation Color
BlackWhite
Current Rating (Amps)
3A3A per Contact8A-
Voltage Rating
250V600V-
Stocking Options
Environmental Options
Media
Marketplace Product
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Mfr Part #
Quantity Available
Price
Series
Package
Product Status
Connector Type
Contact Type
Pitch - Mating
Number of Positions
Number of Rows
Row Spacing - Mating
Number of Positions Loaded
Style
Shrouding
Mounting Type
Termination
Fastening Type
Contact Length - Mating
Contact Length - Post
Overall Contact Length
Insulation Height
Contact Shape
Contact Finish - Mating
Contact Finish Thickness - Mating
Contact Finish - Post
Contact Material
Insulation Material
Features
Operating Temperature
Ingress Protection
Material Flammability Rating
Insulation Color
Current Rating (Amps)
Voltage Rating
0436500327
0436500327
CONN HEADER VERT 3POS 3MM
Molex
16,454
In Stock
1 : ¥9.93000
Tray
Tray
Active
Header
Male Pin
0.118" (3.00mm)
3
1
-
All
Board to Cable/Wire
Shrouded - 4 Wall
Through Hole
Solder
Locking Ramp
-
0.125" (3.18mm)
-
0.390" (9.91mm)
Square
Tin
100.0µin (2.54µm)
Tin
Brass
Liquid Crystal Polymer (LCP), Glass Filled
Board Guide
-
-
UL94 V-0
Black
-
-
0436500427
0436500427
CONN HEADER VERT 4POS 3MM
Molex
6,736
In Stock
1 : ¥11.58000
Tray
Tray
Active
Header
Male Pin
0.118" (3.00mm)
4
1
-
All
Board to Cable/Wire
Shrouded - 4 Wall
Through Hole
Solder
Locking Ramp
-
0.125" (3.18mm)
-
0.390" (9.91mm)
Square
Tin
100.0µin (2.54µm)
Tin
Brass
Liquid Crystal Polymer (LCP), Glass Filled
Board Guide
-
-
UL94 V-0
Black
-
-
0430450812
0430450812
CONN HEADER VERT 8POS 3MM
Molex
12,841
In Stock
1 : ¥15.84000
Tray
Tray
Active
Header
Male Pin
0.118" (3.00mm)
8
2
0.118" (3.00mm)
All
Board to Cable/Wire
Shrouded - 4 Wall
Through Hole
Kinked Pin, Solder
Locking Ramp
-
0.125" (3.18mm)
-
0.390" (9.91mm)
Square
Tin
100.0µin (2.54µm)
Tin
Brass
Liquid Crystal Polymer (LCP), Glass Filled
Board Guide
-40°C ~ 105°C
-
UL94 V-0
Black
8A
600V
77311-x18-xx
77311-118-05LF
CONN HEADER VERT 5POS 2.54MM
Amphenol ICC (FCI)
1,895
In Stock
1 : ¥3.69000
Bulk
Bulk
Active
Header
Male Pin
0.100" (2.54mm)
5
1
-
All
Board to Board
Unshrouded
Through Hole
Solder
Push-Pull
0.230" (5.84mm)
0.120" (3.05mm)
0.450" (11.43mm)
0.100" (2.54mm)
Square
Gold or Gold, GXT™
30.0µin (0.76µm)
Tin
Phosphor Bronze
Thermoplastic
-
-65°C ~ 125°C
-
UL94 V-0
Black
3A per Contact
-
51025-05-0100-01
51025-05-0100-01
WIRE-TO BOARD WAFER, 2.5MM, 5 CO
CNC Tech
10,543
In Stock
1 : ¥1.15000
Bag
-
Bag
Active
Header
Male Pin
0.098" (2.50mm)
5
1
-
All
Board to Cable/Wire
Shrouded - 4 Wall
Through Hole
Kinked Pin, Solder
Detent Lock
-
0.134" (3.40mm)
-
0.276" (7.00mm)
Square
Tin
-
Tin
Brass
Polyamide (PA66), Nylon 6/6
-
-25°C ~ 85°C
-
UL94 V-0
White
3A
250V
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Headers, Male Pins


This type of header contains male pins within a plastic base and is meant to be mated with a rectangular cable connector or a female socket header for board-to-board connection. These come in a variety of position and pitch options, with some having a breakaway option to manually change position count with ease. Some are shrouded with 1 to 4 walls or unshrouded. Mounting types include panel mount, board edge, stacking, surface mount, and through-hole.