System On Chip (SoC)

Results: 2
Package / Case
484-BBGA, FCBGA676-BBGA, FCBGA
Supplier Device Package
484-FCBGA (23x23)676-FCBGA (27x27)
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Series
Package
Product Status
Architecture
Core Processor
Flash Size
RAM Size
Peripherals
Connectivity
Speed
Primary Attributes
Operating Temperature
Package / Case
Supplier Device Package
676-FCBGA
XC7Z030-2FFG676I
IC SOC CORTEX-A9 800MHZ 676FCBGA
AMD
1,049
In Stock
1 : ¥4,785.33000
Tray
Tray
Active
MCU, FPGA
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
-
256KB
DMA
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
800MHz
Kintex™-7 FPGA, 125K Logic Cells
-40°C ~ 100°C (TJ)
676-BBGA, FCBGA
676-FCBGA (27x27)
484-BBGA, FCBGA
XC7Z030-2FBG484I
IC SOC CORTEX-A9 800MHZ 484FCBGA
AMD
3
In Stock
1 : ¥3,212.50000
Tray
Tray
Active
MCU, FPGA
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
-
256KB
DMA
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
800MHz
Kintex™-7 FPGA, 125K Logic Cells
-40°C ~ 100°C (TJ)
484-BBGA, FCBGA
484-FCBGA (23x23)
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of 2

System On Chip (SoC)


Devices in the System-on-Chip family combine on one device substrate several computing system components which traditionally would be implemented as separate devices, such as a general-purpose microprocessor, an FPGA co-processor, and a graphics controller for generation of display data. While limited amounts of data storage resources may also be incorporated, the provision of an interface to external storage devices is typical.