System On Chip (SoC)

Results: 2
Primary Attributes
Artix™-7 FPGA, 85K Logic CellsKintex™-7 FPGA, 125K Logic Cells
Operating Temperature
-40°C ~ 100°C (TJ)0°C ~ 85°C (TJ)
Package / Case
484-LFBGA, CSPBGA676-BBGA, FCBGA
Supplier Device Package
484-CSPBGA (19x19)676-FCBGA (27x27)
Stocking Options
Environmental Options
Media
Marketplace Product
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Mfr Part #
Quantity Available
Price
Series
Package
Product Status
Architecture
Core Processor
Flash Size
RAM Size
Peripherals
Connectivity
Speed
Primary Attributes
Operating Temperature
Package / Case
Supplier Device Package
676-FCBGA Series
XC7Z030-1FBG676C
IC SOC CORTEX-A9 667MHZ 676FCBGA
AMD
369
In Stock
1 : ¥2,652.38000
Tray
Tray
Active
MCU, FPGA
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
-
256KB
DMA
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
667MHz
Kintex™-7 FPGA, 125K Logic Cells
0°C ~ 85°C (TJ)
676-BBGA, FCBGA
676-FCBGA (27x27)
484-LFBGA
XC7Z020-1CLG484I
IC SOC CORTEX-A9 667MHZ 484BGA
AMD
0
In Stock
Check Lead Time
1 : ¥1,419.48000
Tray
Tray
Active
MCU, FPGA
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
-
256KB
DMA
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
667MHz
Artix™-7 FPGA, 85K Logic Cells
-40°C ~ 100°C (TJ)
484-LFBGA, CSPBGA
484-CSPBGA (19x19)
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of 2

System On Chip (SoC)


Devices in the System-on-Chip family combine on one device substrate several computing system components which traditionally would be implemented as separate devices, such as a general-purpose microprocessor, an FPGA co-processor, and a graphics controller for generation of display data. While limited amounts of data storage resources may also be incorporated, the provision of an interface to external storage devices is typical.