Edgeboard Connectors

Results: 2
Manufacturer
Amphenol ICC (FCI)TE Connectivity AMP Connectors
Series
-M.2
Packaging
Cut Tape (CT)Digi-Reel®Tape & Reel (TR)
Card Type
M.2 (NGFF) Mini CardPCI Express Mini Card
Number of Positions/Bay/Row
8; 18-
Number of Positions
5267
Card Thickness
0.039" (1.00mm)-
Pitch
0.020" (0.50mm)0.031" (0.80mm)
Features
Board GuideBoard Lock, Keyed M
Contact Finish Thickness
30.0µin (0.76µm)Flash
Operating Temperature
-55°C ~ 85°C-40°C ~ 80°C
Stocking Options
Environmental Options
Media
Marketplace Product
2Results

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Mfr Part #
Quantity Available
Price
Series
Package
Product Status
Card Type
Gender
Number of Positions/Bay/Row
Number of Positions
Card Thickness
Number of Rows
Pitch
Read Out
Features
Mounting Type
Termination
Contact Material
Contact Finish
Contact Finish Thickness
Contact Type
Color
Flange Feature
Operating Temperature
1775838-2
1775838-2
CONN PCI EXP MIN FML 52POS 0.031
TE Connectivity AMP Connectors
3,861
In Stock
1 : ¥9.69000
Cut Tape (CT)
500 : ¥6.88302
Tape & Reel (TR)
-
Tape & Reel (TR)
Cut Tape (CT)
Digi-Reel®
Active
PCI Express Mini Card
Female
8; 18
52
0.039" (1.00mm)
2
0.031" (0.80mm)
Dual
Board Guide
Surface Mount, Right Angle
Solder
Copper Alloy
Gold
Flash
-
Black
-
-55°C ~ 85°C
MDT320x0x001
MDT320M01001
CONN M.2 FMALE 67POS 0.020 GOLD
Amphenol ICC (FCI)
3,210
In Stock
1 : ¥13.30000
Cut Tape (CT)
900 : ¥8.66824
Tape & Reel (TR)
Tape & Reel (TR)
Cut Tape (CT)
Digi-Reel®
Active
M.2 (NGFF) Mini Card
Female
-
67
-
2
0.020" (0.50mm)
Dual
Board Lock, Keyed M
Surface Mount, Right Angle
Solder
Copper Alloy
Gold
30.0µin (0.76µm)
-
Black
-
-40°C ~ 80°C
Showing
of 2

Edgeboard Connectors


Card edge or edgeboard connectors are a style of connector system in which (typically) a pattern of exposed copper regions at the periphery of a printed circuit board constitutes one-half of a mating connector pair. A common use case being the connection of accessory cards such as graphics accelerators to computer motherboards in desktop PC applications, they offer a relatively low-cost, high density interconnect option for applications where durability is not a primary concern.