Single Diodes

Results: 2
Manufacturer
Diodes IncorporatedVishay General Semiconductor - Diodes Division
Packaging
Cut Tape (CT)Digi-Reel®Tape & Reel (TR)
Technology
SchottkyStandard
Current - Average Rectified (Io)
200mA1A
Voltage - Forward (Vf) (Max) @ If
790 mV @ 1 A1.25 V @ 200 mA
Speed
Fast Recovery =< 500ns, > 200mA (Io)Small Signal =< 200mA (Io), Any Speed
Current - Reverse Leakage @ Vr
100 nA @ 100 V500 µA @ 100 V
Capacitance @ Vr, F
5pF @ 0V, 1MHz80pF @ 4V, 1MHz
Package / Case
DO-214AC, SMATO-236-3, SC-59, SOT-23-3
Supplier Device Package
SMASOT-23-3
Operating Temperature - Junction
-65°C ~ 150°C-55°C ~ 150°C
Stocking Options
Environmental Options
Media
Marketplace Product
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Mfr Part #
Quantity Available
Price
Series
Package
Product Status
Technology
Voltage - DC Reverse (Vr) (Max)
Current - Average Rectified (Io)
Voltage - Forward (Vf) (Max) @ If
Speed
Reverse Recovery Time (trr)
Current - Reverse Leakage @ Vr
Capacitance @ Vr, F
Mounting Type
Package / Case
Supplier Device Package
Operating Temperature - Junction
DO-214AC
B1100-13-F
DIODE SCHOTTKY 100V 1A SMA
Diodes Incorporated
49,601
In Stock
15,425,000
Factory
1 : ¥2.87000
Cut Tape (CT)
5,000 : ¥0.73497
Tape & Reel (TR)
-
Tape & Reel (TR)
Cut Tape (CT)
Digi-Reel®
Active
Schottky
100 V
1A
790 mV @ 1 A
Fast Recovery =< 500ns, > 200mA (Io)
-
500 µA @ 100 V
80pF @ 4V, 1MHz
Surface Mount
DO-214AC, SMA
SMA
-65°C ~ 150°C
40,801
In Stock
1 : ¥1.72000
Cut Tape (CT)
3,000 : ¥0.20612
Tape & Reel (TR)
-
Tape & Reel (TR)
Cut Tape (CT)
Digi-Reel®
Active
Standard
100 V
200mA
1.25 V @ 200 mA
Small Signal =< 200mA (Io), Any Speed
50 ns
100 nA @ 100 V
5pF @ 0V, 1MHz
Surface Mount
TO-236-3, SC-59, SOT-23-3
SOT-23-3
-55°C ~ 150°C
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Single Diodes


Products within the single rectifier diode family are used to allow current flow in one direction only, and implement exactly one instance of this function per device package. Diodes used for other purposes (including zener and variable capacitance diodes) are listed separately in product families of their own, as are products incorporating multiple diodes per device package.