Edgeboard Connectors

Results: 3
Packaging
Cut Tape (CT)Tape & Reel (TR)
Number of Positions/Bay/Row
304060
Number of Positions
6080120
Stocking Options
Environmental Options
Media
Marketplace Product
3Results

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Mfr Part #
Quantity Available
Price
Series
Package
Product Status
Card Type
Gender
Number of Positions/Bay/Row
Number of Positions
Card Thickness
Number of Rows
Pitch
Read Out
Features
Mounting Type
Termination
Contact Material
Contact Finish
Contact Finish Thickness
Contact Type
Color
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Operating Temperature
FX27-60S-0.8SV
FX27-60S-0.8SV
CONN PCI EXP FMALE 60POS 0.031
Hirose Electric Co Ltd
116
In Stock
1 : ¥50.74000
Cut Tape (CT)
300 : ¥35.59497
Tape & Reel (TR)
Tape & Reel (TR)
Cut Tape (CT)
Active
PCI Express™
Female
30
60
0.063" (1.60mm)
2
0.031" (0.80mm)
Dual
Board Guide, Pick and Place, Solder Retention
Surface Mount
Solder
Copper Alloy
Gold
-
-
Black
-
-55°C ~ 85°C
FX27-80S-0.8SV
FX27-80S-0.8SV
CONN PCI EXP FMALE 80POS 0.031
Hirose Electric Co Ltd
1,109
In Stock
1 : ¥60.26000
Cut Tape (CT)
300 : ¥42.71040
Tape & Reel (TR)
Tape & Reel (TR)
Cut Tape (CT)
Active
PCI Express™
Female
40
80
0.063" (1.60mm)
2
0.031" (0.80mm)
Dual
Board Guide, Pick and Place, Solder Retention
Surface Mount
Solder
Copper Alloy
Gold
-
-
Black
-
-55°C ~ 85°C
FX27-120S-0.8SV
FX27-120S-0.8SV
CONN PCI EXP FMALE 120POS 0.031
Hirose Electric Co Ltd
109
In Stock
1 : ¥76.84000
Cut Tape (CT)
150 : ¥56.75820
Tape & Reel (TR)
Tape & Reel (TR)
Cut Tape (CT)
Active
PCI Express™
Female
60
120
0.063" (1.60mm)
2
0.031" (0.80mm)
Dual
Board Guide, Pick and Place, Solder Retention
Surface Mount
Solder
Copper Alloy
Gold
-
-
Black
-
-55°C ~ 85°C
Showing
of 3

Edgeboard Connectors


Card edge or edgeboard connectors are a style of connector system in which (typically) a pattern of exposed copper regions at the periphery of a printed circuit board constitutes one-half of a mating connector pair. A common use case being the connection of accessory cards such as graphics accelerators to computer motherboards in desktop PC applications, they offer a relatively low-cost, high density interconnect option for applications where durability is not a primary concern.