Edgeboard Connectors

Results: 2
Manufacturer
Amphenol ICC (FCI)KYOCERA AVX
Series
-6411
Packaging
Cut Tape (CT)Digi-Reel®Tape & Reel (TR)Tray
Card Type
-PCI Express™
Number of Positions
3667
Card Thickness
0.062" (1.57mm)-
Pitch
0.020" (0.50mm)0.039" (1.00mm)
Features
Board Guide, KeyedBoard Guide, Locking Ramp, Pick and Place, Solder Retention
Mounting Type
Surface MountSurface Mount, Right Angle
Contact Finish Thickness
2.00µin (0.051µm)15.0µin (0.38µm)
Contact Type
-Cantilever
Color
-Black
Operating Temperature
-55°C ~ 85°C-40°C ~ 80°C
Stocking Options
Environmental Options
Media
Marketplace Product
2Results

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Mfr Part #
Quantity Available
Price
Series
Package
Product Status
Card Type
Gender
Number of Positions/Bay/Row
Number of Positions
Card Thickness
Number of Rows
Pitch
Read Out
Features
Mounting Type
Termination
Contact Material
Contact Finish
Contact Finish Thickness
Contact Type
Color
Flange Feature
Operating Temperature
10061913-110CLF
10061913-110CLF
CONN PCI EXP FMALE 36POS 0.039
Amphenol ICC (FCI)
641
In Stock
1 : ¥15.19000
Tray
-
Tray
Active
PCI Express™
Female
-
36
0.062" (1.57mm)
2
0.039" (1.00mm)
Dual
Board Guide, Locking Ramp, Pick and Place, Solder Retention
Surface Mount
Solder
Copper Alloy
Gold
15.0µin (0.38µm)
Cantilever
Black
-
-55°C ~ 85°C
6411 Series
246411067401894E
CONN FEMALE 67POS 0.020 GOLD
KYOCERA AVX
2,000
In Stock
1 : ¥13.71000
Cut Tape (CT)
800 : ¥8.62523
Tape & Reel (TR)
Tape & Reel (TR)
Cut Tape (CT)
Digi-Reel®
Active
-
Female
-
67
-
2
0.020" (0.50mm)
Dual
Board Guide, Keyed
Surface Mount, Right Angle
Solder
Copper Alloy
Gold
2.00µin (0.051µm)
-
-
-
-40°C ~ 80°C
Showing
of 2

Edgeboard Connectors


Card edge or edgeboard connectors are a style of connector system in which (typically) a pattern of exposed copper regions at the periphery of a printed circuit board constitutes one-half of a mating connector pair. A common use case being the connection of accessory cards such as graphics accelerators to computer motherboards in desktop PC applications, they offer a relatively low-cost, high density interconnect option for applications where durability is not a primary concern.