Adapter, Breakout Boards

Results: 3
Manufacturer
Aries ElectronicsChip Quik Inc.
Series
Correct-A-Chip®Proto-Advantage
Package Accepted
MSOPSOICSOT23
Number of Positions
61016
Pitch
0.020" (0.50mm)0.037" (0.95mm)0.050" (1.27mm)
Size / Dimension
0.400" L x 0.500" W (10.16mm x 12.70mm)0.600" L x 0.500" W (15.24mm x 12.70mm)0.700" x 0.800" (17.78mm x 20.32mm)
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Media
Marketplace Product
3Results

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Mfr Part #
Quantity Available
Price
Series
Package
Product Status
Proto Board Type
Package Accepted
Number of Positions
Pitch
Board Thickness
Material
Size / Dimension
LCQT-SOT23-6
LCQT-SOT23-6
SOCKET ADAPTER SOT-23 TO 6DIP
Aries Electronics
1,865
In Stock
1 : ¥23.23000
Bulk
Bulk
Active
SMD to DIP
SOT23
6
0.037" (0.95mm)
0.062" (1.57mm) 1/16"
FR4 Epoxy Glass
0.400" L x 0.500" W (10.16mm x 12.70mm)
PA0006
PA0006
SOIC-16 TO DIP-16 SMT ADAPTER
Chip Quik Inc.
434
In Stock
1 : ¥33.58000
Bulk
Bulk
Active
SMD to DIP
SOIC
16
0.050" (1.27mm)
0.062" (1.57mm) 1/16"
FR4 Epoxy Glass
0.700" x 0.800" (17.78mm x 20.32mm)
LCQT-MSOP10
LCQT-MSOP10
SOCKET ADAPTER MSOP TO 10DIP
Aries Electronics
296
In Stock
1 : ¥26.11000
Bulk
Bulk
Active
SMD to DIP
MSOP
10
0.020" (0.50mm)
0.062" (1.57mm) 1/16"
FR4 Epoxy Glass
0.600" L x 0.500" W (15.24mm x 12.70mm)
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of 3

Adapter, Breakout Boards


Products in this family provide increased convenience of access to the electrical contacts of a connector, integrated circuit, or similar device by providing interconnection between a component placement area (typically for a fine-pitch, surface mounted integrated circuit) and an interconnect area typically having a much larger distance between pin centers. A common application is accommodating the use of solderless breadboards as a prototyping method for components that are not available in breadboard-compatible packaging.