Adapter, Breakout Boards

Results: 2
Manufacturer
Aries ElectronicsLogical Systems Inc.
Series
-Correct-A-Chip®
Package Accepted
SOT23SSOP, TSSOP
Number of Positions
628
Pitch
0.026" (0.65mm)0.037" (0.95mm)
Board Thickness
0.062" (1.57mm) 1/16"-
Material
-FR4 Epoxy Glass
Size / Dimension
0.400" L x 0.500" W (10.16mm x 12.70mm)1.450" L x 0.750" W (36.83mm x 19.05mm)
Stocking Options
Environmental Options
Media
Marketplace Product
2Results

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of 2
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Mfr Part #
Quantity Available
Price
Series
Package
Product Status
Proto Board Type
Package Accepted
Number of Positions
Pitch
Board Thickness
Material
Size / Dimension
LCQT-SOT23-6
LCQT-SOT23-6
SOCKET ADAPTER SOT-23 TO 6DIP
Aries Electronics
1,934
In Stock
1 : ¥23.23000
Bulk
Bulk
Active
SMD to DIP
SOT23
6
0.037" (0.95mm)
0.062" (1.57mm) 1/16"
FR4 Epoxy Glass
0.400" L x 0.500" W (10.16mm x 12.70mm)
pa-ssd6sm18-28
PA-SSD6SM18-28
ADAPTER 28TSSOP TO 28DIP(600MIL)
Logical Systems Inc.
1
In Stock
1 : ¥114.94000
Bulk
-
Bulk
Active
SMD to DIP
SSOP, TSSOP
28
0.026" (0.65mm)
-
-
1.450" L x 0.750" W (36.83mm x 19.05mm)
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of 2

Adapter, Breakout Boards


Products in this family provide increased convenience of access to the electrical contacts of a connector, integrated circuit, or similar device by providing interconnection between a component placement area (typically for a fine-pitch, surface mounted integrated circuit) and an interconnect area typically having a much larger distance between pin centers. A common application is accommodating the use of solderless breadboards as a prototyping method for components that are not available in breadboard-compatible packaging.