Adapter, Breakout Boards

Results: 3
Manufacturer
Adafruit Industries LLCAries Electronics
Series
-Correct-A-Chip®
Package Accepted
QFN, QFPSOICSOIC, TSSOP
Number of Positions
82832
Pitch
0.050" (1.27mm)-
Board Thickness
0.062" (1.57mm) 1/16"-
Material
-FR4 Epoxy Glass
Size / Dimension
0.500" L x 0.500" W (12.70mm x 12.70mm)1.400" L x 0.700" W (35.56mm x 17.78mm)1.600" L x 0.700" W (40.64mm x 17.78mm)
Stocking Options
Environmental Options
Media
Marketplace Product
3Results

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of 3
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Mfr Part #
Quantity Available
Price
Series
Package
Product Status
Proto Board Type
Package Accepted
Number of Positions
Pitch
Board Thickness
Material
Size / Dimension
LCQT-SOIC8-8
LCQT-SOIC8-8
SOCKET ADAPTER SOIC TO 8DIP
Aries Electronics
6,282
In Stock
1 : ¥24.87000
Bulk
Bulk
Active
SMD to DIP
SOIC
8
0.050" (1.27mm)
0.062" (1.57mm) 1/16"
FR4 Epoxy Glass
0.500" L x 0.500" W (12.70mm x 12.70mm)
1208
1208
SMT ADAPTERS 3 PACK 28SOIC/TSSOP
Adafruit Industries LLC
67
In Stock
1 : ¥40.64000
Bulk
-
Bulk
Active
SMD to DIP
SOIC, TSSOP
28
-
-
-
1.400" L x 0.700" W (35.56mm x 17.78mm)
1163 TQFP-32
1163
SMT ADAPTERS 3 PACK 32QFN/TQFP
Adafruit Industries LLC
23
In Stock
1 : ¥48.85000
Bulk
-
Bulk
Active
SMD to DIP
QFN, QFP
32
-
-
-
1.600" L x 0.700" W (40.64mm x 17.78mm)
Showing
of 3

Adapter, Breakout Boards


Products in this family provide increased convenience of access to the electrical contacts of a connector, integrated circuit, or similar device by providing interconnection between a component placement area (typically for a fine-pitch, surface mounted integrated circuit) and an interconnect area typically having a much larger distance between pin centers. A common application is accommodating the use of solderless breadboards as a prototyping method for components that are not available in breadboard-compatible packaging.