Heat Sinks

Results: 15
Manufacturer
Advanced Thermal Solutions Inc.Assmann WSW ComponentsBoyd Laconia, LLCCUI DevicesSeeed Technology Co., LtdWakefield-Vette
Series
-658HSBmaxiFLOW
Packaging
BoxBulkTray
Type
Top MountTop Mount Kit
Package Cooled
Assorted (BGA, LGA, CPU, ASIC...)BGARaspberry Pi 4B
Attachment Method
AdhesiveAdhesive (Not Included)Thermal Tape, Adhesive (Included)Thermal Tape, Adhesive (Not Included)
Shape
-Square, Angled FinsSquare, Pin Fins
Length
0.598" (15.19mm)0.669" (17.00mm)0.906" (23.01mm)1.063" (27.00mm)1.100" (27.94mm)1.378" (35.00mm)1.575" (40.00mm)1.772" (45.00mm)-
Width
0.598" (15.19mm)0.669" (17.00mm)0.906" (23.01mm)1.063" (27.00mm)1.100" (27.94mm)1.378" (35.00mm)1.575" (40.01mm)1.772" (45.00mm)-
Fin Height
0.236" (6.00mm)0.252" (6.40mm)0.295" (7.50mm)0.394" (10.00mm)0.450" (11.43mm)0.453" (11.50mm)0.600" (15.24mm)0.709" (18.00mm)-
Power Dissipation @ Temperature Rise
1.0W @ 40°C1.5W @ 40°C2.0W @ 30°C2.0W @ 50°C2.5W @ 30°C3.0W @ 50°C3.1W @ 75°C3.8W @ 75°C4.0W @ 80°C-
Thermal Resistance @ Forced Air Flow
2.00°C/W @ 500 LFM4.00°C/W @ 200 LFM4.30°C/W @ 200 LFM5.20°C/W @ 200 LFM6.00°C/W @ 200 LFM6.50°C/W @ 200 LFM7.40°C/W @ 200 LFM7.60°C/W @ 200 LFM7.80°C/W @ 200 LFM8.40°C/W @ 200 LFM11.70°C/W @ 200 LFM17.60°C/W @ 200 LFM-
Thermal Resistance @ Natural
12.00°C/W15.30°C/W19.59°C/W20.00°C/W20.30°C/W23.40°C/W23.91°C/W40.00°C/W62.50°C/W-
Material
AluminumAluminum Alloy
Material Finish
-Black AnodizedBlue Anodized
Stocking Options
Environmental Options
Media
Marketplace Product
15Results
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Mfr Part #
Quantity Available
Price
Series
Package
Product Status
Type
Package Cooled
Attachment Method
Shape
Length
Width
Diameter
Fin Height
Power Dissipation @ Temperature Rise
Thermal Resistance @ Forced Air Flow
Thermal Resistance @ Natural
Material
Material Finish
110991327
110991327
HEAT SINK KIT FOR RASPBERRY PI 4
Seeed Technology Co., Ltd
28,209
In Stock
1 : ¥8.13000
Bulk
-
Bulk
Active
Top Mount Kit
Raspberry Pi 4B
Adhesive
-
-
-
-
-
-
-
-
Aluminum
-
HSB05-171711
HSB05-171711
HEAT SINK, BGA, 17 X 17 X 11.5 M
CUI Devices
6,432
In Stock
1 : ¥8.87000
Box
Box
Active
Top Mount
BGA
Adhesive (Not Included)
Square, Pin Fins
0.669" (17.00mm)
0.669" (17.00mm)
-
0.453" (11.50mm)
3.1W @ 75°C
8.40°C/W @ 200 LFM
23.91°C/W
Aluminum Alloy
Black Anodized
375424B00034G
375424B00034G
HEATSINK PIN-FIN W/TAPE
Boyd Laconia, LLC
3,742
In Stock
1 : ¥10.92000
Bulk
-
Bulk
Active
Top Mount
BGA
Thermal Tape, Adhesive (Included)
Square, Pin Fins
0.598" (15.19mm)
0.598" (15.19mm)
-
0.252" (6.40mm)
-
17.60°C/W @ 200 LFM
62.50°C/W
Aluminum
Black Anodized
658-60ABT1E
658-60ABT1E
HEATSINK CPU 28MM SQ BLK W/TAPE
Wakefield-Vette
19,758
In Stock
1 : ¥30.13000
Bulk
Bulk
Active
Top Mount
BGA
Thermal Tape, Adhesive (Included)
Square, Pin Fins
1.100" (27.94mm)
1.100" (27.94mm)
-
0.600" (15.24mm)
2.5W @ 30°C
2.00°C/W @ 500 LFM
-
Aluminum
Black Anodized
3,158
In Stock
1,560
Factory
1 : ¥5.66000
Bulk
-
Bulk
Active
Top Mount
Assorted (BGA, LGA, CPU, ASIC...)
Thermal Tape, Adhesive (Not Included)
Square, Pin Fins
1.063" (27.00mm)
1.063" (27.00mm)
-
0.236" (6.00mm)
-
-
20.00°C/W
Aluminum Alloy
Black Anodized
HSB12-272706
HSB12-272706
HEAT SINK, BGA, 27 X 27 X 6 MM
CUI Devices
1,226
In Stock
1 : ¥7.31000
Box
Box
Active
Top Mount
BGA
Adhesive (Not Included)
Square, Pin Fins
1.063" (27.00mm)
1.063" (27.00mm)
-
0.236" (6.00mm)
3.8W @ 75°C
7.80°C/W @ 200 LFM
19.59°C/W
Aluminum Alloy
Black Anodized
374024B00035G
374024B00035G
HEATSINK BGA 23X23X10MM W/ADH
Boyd Laconia, LLC
577
In Stock
1 : ¥15.84000
Bulk
-
Bulk
Active
Top Mount
BGA
Thermal Tape, Adhesive (Included)
Square, Pin Fins
0.906" (23.01mm)
0.906" (23.01mm)
-
0.394" (10.00mm)
1.0W @ 40°C
11.70°C/W @ 200 LFM
40.00°C/W
Aluminum
Black Anodized
374424B00035G
374424B00035G
HEATSINK BGA W/ADHESIVE TAPE
Boyd Laconia, LLC
2,003
In Stock
1 : ¥19.29000
Bulk
-
Bulk
Active
Top Mount
BGA
Thermal Tape, Adhesive (Included)
Square, Pin Fins
1.063" (27.00mm)
1.063" (27.00mm)
-
0.709" (18.00mm)
4.0W @ 80°C
6.50°C/W @ 200 LFM
20.30°C/W
Aluminum
Black Anodized
375024B00032(G)
375024B00032G
HEATSINK BGA W/ADHESIVE TAPE
Boyd Laconia, LLC
1,330
In Stock
1 : ¥26.11000
Bulk
-
Bulk
Active
Top Mount
BGA
Thermal Tape, Adhesive (Included)
Square, Pin Fins
1.575" (40.00mm)
1.575" (40.01mm)
-
0.709" (18.00mm)
2.0W @ 30°C
4.30°C/W @ 200 LFM
12.00°C/W
Aluminum
Black Anodized
374924B00032(G)
374924B00032G
HEATSINK BGA W/ADHESIVE TAPE
Boyd Laconia, LLC
637
In Stock
1 : ¥26.60000
Bulk
-
Bulk
Active
Top Mount
BGA
Thermal Tape, Adhesive (Included)
Square, Pin Fins
1.575" (40.00mm)
1.575" (40.01mm)
-
0.394" (10.00mm)
4.0W @ 80°C
6.50°C/W @ 200 LFM
20.30°C/W
Aluminum
Black Anodized
374724B00032(G), 374724B00035G
374724B00032G
HEATSINK BGA W/ADHESIVE TAPE
Boyd Laconia, LLC
1,302
In Stock
1 : ¥29.14000
Bulk
-
Bulk
Active
Top Mount
BGA
Thermal Tape, Adhesive (Included)
Square, Pin Fins
1.378" (35.00mm)
1.378" (35.00mm)
-
0.709" (18.00mm)
3.0W @ 50°C
5.20°C/W @ 200 LFM
15.30°C/W
Aluminum
Black Anodized
658-45AB, T3, T4
658-45ABT3
HEATSINK CPU 28MM SQ BLK W/TAPE
Wakefield-Vette
26,449
In Stock
1 : ¥31.36000
Bulk
Bulk
Active
Top Mount
BGA
Thermal Tape, Adhesive (Included)
Square, Pin Fins
1.100" (27.94mm)
1.100" (27.94mm)
-
0.450" (11.43mm)
3.0W @ 50°C
6.00°C/W @ 200 LFM
-
Aluminum
Black Anodized
374624B00035G, 374624B00032(G)
374624B00032G
HEATSINK BGA 35X35X10MM W/ADH
Boyd Laconia, LLC
68
In Stock
1 : ¥28.65000
Bulk
-
Bulk
Active
Top Mount
BGA
Thermal Tape, Adhesive (Included)
Square, Pin Fins
1.378" (35.00mm)
1.378" (35.00mm)
-
0.394" (10.00mm)
1.5W @ 40°C
7.60°C/W @ 200 LFM
23.40°C/W
Aluminum
Black Anodized
57
In Stock
1 : ¥77.01000
Tray
Tray
Active
Top Mount
BGA
Thermal Tape, Adhesive (Included)
Square, Angled Fins
1.772" (45.00mm)
1.772" (45.00mm)
-
0.295" (7.50mm)
-
4.00°C/W @ 200 LFM
-
Aluminum
Blue Anodized
374124B00035G
374124B00035G
HEATSINK BGA W/ADHESIVE TAPE
Boyd Laconia, LLC
0
In Stock
1 : ¥16.34000
Bulk
-
Bulk
Active
Top Mount
BGA
Thermal Tape, Adhesive (Included)
Square, Pin Fins
0.906" (23.01mm)
0.906" (23.01mm)
-
0.709" (18.00mm)
2.0W @ 50°C
7.40°C/W @ 200 LFM
23.40°C/W
Aluminum
Black Anodized
Showing
of 15

Heat Sinks

Passive heat exchangers that transfer the heat generated by an electronic component to a fluid medium, often air or a liquid coolant, dissipating it away from the device to maintain an optimal operating temperature. They are designed to maximize the surface area in contact with the medium surrounding it. They are usually made out of copper or aluminum due to their high thermal conductivity.