Heat Sinks

Results: 2
Manufacturer
Advanced Thermal Solutions Inc.Wakefield-Vette
Series
655fanSINK, maxiGRIP
Package Cooled
Assorted (BGA, LGA, CPU, ASIC...)BGA
Attachment Method
Clip, Thermal MaterialThermal Tape, Adhesive (Not Included)
Length
1.575" (40.00mm)1.600" (40.64mm)
Width
1.575" (40.00mm)1.600" (40.64mm)
Fin Height
0.522" (13.27mm)0.965" (24.50mm)
Power Dissipation @ Temperature Rise
4.0W @ 40°C-
Thermal Resistance @ Forced Air Flow
1.30°C/W @ 200 LFM2.00°C/W @ 400 LFM
Stocking Options
Environmental Options
Media
Marketplace Product
2Results
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of 2
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Mfr Part #
Quantity Available
Price
Series
Package
Product Status
Type
Package Cooled
Attachment Method
Shape
Length
Width
Diameter
Fin Height
Power Dissipation @ Temperature Rise
Thermal Resistance @ Forced Air Flow
Thermal Resistance @ Natural
Material
Material Finish
655-53AB
655-53AB
HEATSINK CPU 40.6MM SQ H=.525"
Wakefield-Vette
3,492
In Stock
1 : ¥26.03000
Bulk
Bulk
Active
Top Mount
Assorted (BGA, LGA, CPU, ASIC...)
Thermal Tape, Adhesive (Not Included)
Square, Pin Fins
1.600" (40.64mm)
1.600" (40.64mm)
-
0.522" (13.27mm)
4.0W @ 40°C
2.00°C/W @ 400 LFM
-
Aluminum
Black Anodized
225
In Stock
1 : ¥156.97000
Bulk
Bulk
Active
Top Mount
BGA
Clip, Thermal Material
Square, Pin Fins
1.575" (40.00mm)
1.575" (40.00mm)
-
0.965" (24.50mm)
-
1.30°C/W @ 200 LFM
-
Aluminum
Black Anodized
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of 2

Heat Sinks

Passive heat exchangers that transfer the heat generated by an electronic component to a fluid medium, often air or a liquid coolant, dissipating it away from the device to maintain an optimal operating temperature. They are designed to maximize the surface area in contact with the medium surrounding it. They are usually made out of copper or aluminum due to their high thermal conductivity.