IC Sockets

Results: 3
Manufacturer
Aries ElectronicsMill-Max Manufacturing Corp.On Shore Technology Inc.
Series
110Lo-PRO®file, 513SA
Packaging
BulkTube
Number of Positions or Pins (Grid)
10 (2 x 5)16 (2 x 8)
Contact Finish - Mating
GoldTin-Lead
Contact Finish Thickness - Mating
10.0µin (0.25µm)200.0µin (5.08µm)Flash
Features
Closed FrameOpen Frame
Contact Finish - Post
TinTin-Lead
Contact Material - Post
BrassBrass Alloy
Housing Material
Polyamide (PA46), Nylon 4/6, Glass FilledPolycyclohexylenedimethylene Terephthalate (PCT), PolyesterThermoplastic, Polyester, Glass Filled
Operating Temperature
-55°C ~ 105°C-55°C ~ 125°C-40°C ~ 105°C
Stocking Options
Environmental Options
Media
Marketplace Product
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Mfr Part #
Quantity Available
Price
Series
Package
Product Status
Type
Number of Positions or Pins (Grid)
Pitch - Mating
Contact Finish - Mating
Contact Finish Thickness - Mating
Contact Material - Mating
Mounting Type
Features
Termination
Pitch - Post
Contact Finish - Post
Contact Finish Thickness - Post
Contact Material - Post
Housing Material
Operating Temperature
110-41-316-41-001000
110-99-316-41-001000
CONN IC DIP SOCKET 16POS TINLEAD
Mill-Max Manufacturing Corp.
3,238
In Stock
1 : ¥10.84000
Tube
Tube
Active
DIP, 0.3" (7.62mm) Row Spacing
16 (2 x 8)
0.100" (2.54mm)
Tin-Lead
200.0µin (5.08µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin-Lead
200.0µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
Lo-PRO 513 SERIES
10-3513-10
CONN IC DIP SOCKET 10POS GOLD
Aries Electronics
3,337
In Stock
1 : ¥16.34000
Bulk
Bulk
Active
DIP, 0.3" (7.62mm) Row Spacing
10 (2 x 5)
0.100" (2.54mm)
Gold
10.0µin (0.25µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin
200.0µin (5.08µm)
Brass
Polyamide (PA46), Nylon 4/6, Glass Filled
-55°C ~ 105°C
SA103000
SA103000
CONN IC DIP SOCKET 10POS GOLD
On Shore Technology Inc.
4,653
In Stock
1 : ¥5.01000
Tube
Tube
Active
DIP, 0.3" (7.62mm) Row Spacing
10 (2 x 5)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200.0µin (5.08µm)
Brass
Thermoplastic, Polyester, Glass Filled
-40°C ~ 105°C
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of 3

IC Sockets


Sockets provide for repeated insertion, removal, substitution and replacement of Integrated Circuits (ICs) and transistors in a circuit. Mounting types include chassis, panel, connector, board surface and through-hole. Socket features include board guides, carriers, flanges, and open and closed framing. They are differentiated by post pitch, contact material and finish, termination style and contact finish.