Headers, Male Pins

Results: 2
Number of Positions
28
Contact Finish Thickness - Mating
10.0µin (0.25µm)30.0µin (0.76µm)
Contact Finish - Post
GoldTin
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Mfr Part #
Quantity Available
Price
Series
Package
Product Status
Connector Type
Contact Type
Pitch - Mating
Number of Positions
Number of Rows
Row Spacing - Mating
Number of Positions Loaded
Style
Shrouding
Mounting Type
Termination
Fastening Type
Contact Length - Mating
Contact Length - Post
Overall Contact Length
Insulation Height
Contact Shape
Contact Finish - Mating
Contact Finish Thickness - Mating
Contact Finish - Post
Contact Material
Insulation Material
Features
Operating Temperature
Ingress Protection
Material Flammability Rating
Insulation Color
Current Rating (Amps)
Voltage Rating
HTSW-102-14-G-S
HTSW-102-14-G-S
CONN HEADER VERT 2POS 2.54MM
Samtec Inc.
15,594
In Stock
6,048
Factory
1 : ¥3.45000
Bag
Bag
Active
Header
Male Pin
0.100" (2.54mm)
2
1
-
All
Board to Board or Cable
Unshrouded
Through Hole
Solder
Push-Pull
0.320" (8.13mm)
0.110" (2.79mm)
0.530" (13.46mm)
0.100" (2.54mm)
Square
Gold
10.0µin (0.25µm)
Gold
Phosphor Bronze
Liquid Crystal Polymer (LCP)
-
-55°C ~ 125°C
-
UL94 V-0
Natural
Varies by Wire Gauge
-
HTSW-1xx-14-x-S
HTSW-108-14-S-S
CONN HEADER VERT 8POS 2.54MM
Samtec Inc.
16
In Stock
4,108
Factory
1 : ¥15.68000
Bag
Bag
Active
Header
Male Pin
0.100" (2.54mm)
8
1
-
All
Board to Board or Cable
Unshrouded
Through Hole
Solder
Push-Pull
0.320" (8.13mm)
0.110" (2.79mm)
0.530" (13.46mm)
0.100" (2.54mm)
Square
Gold
30.0µin (0.76µm)
Tin
Phosphor Bronze
Liquid Crystal Polymer (LCP)
-
-55°C ~ 125°C
-
UL94 V-0
Natural
Varies by Wire Gauge
-
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Headers, Male Pins


This type of header contains male pins within a plastic base and is meant to be mated with a rectangular cable connector or a female socket header for board-to-board connection. These come in a variety of position and pitch options, with some having a breakaway option to manually change position count with ease. Some are shrouded with 1 to 4 walls or unshrouded. Mounting types include panel mount, board edge, stacking, surface mount, and through-hole.