Adapter, Breakout Boards

Results: 2
Manufacturer
Adafruit Industries LLCChip Quik Inc.
Series
-Proto-Advantage
Package Accepted
SOIC, SOPSOIC, TSSOP
Pitch
0.050" (1.27mm)-
Board Thickness
0.062" (1.57mm) 1/16"-
Material
-FR4 Epoxy Glass
Size / Dimension
0.800" x 1.400" (20.32mm x 35.56mm)1.400" L x 0.700" W (35.56mm x 17.78mm)
Stocking Options
Environmental Options
Media
Marketplace Product
2Results

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of 2
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Mfr Part #
Quantity Available
Price
Series
Package
Product Status
Proto Board Type
Package Accepted
Number of Positions
Pitch
Board Thickness
Material
Size / Dimension
PCB3001-1
PCB3001-1
SOIC28W/N AND SOP28 TO DIP SMT A
Chip Quik Inc.
196
In Stock
1 : ¥26.19000
Bulk
Bulk
Active
SMD to DIP
SOIC, SOP
28
0.050" (1.27mm)
0.062" (1.57mm) 1/16"
FR4 Epoxy Glass
0.800" x 1.400" (20.32mm x 35.56mm)
1208
1208
SMT ADAPTERS 3 PACK 28SOIC/TSSOP
Adafruit Industries LLC
68
In Stock
1 : ¥40.64000
Bulk
-
Bulk
Active
SMD to DIP
SOIC, TSSOP
28
-
-
-
1.400" L x 0.700" W (35.56mm x 17.78mm)
Showing
of 2

Adapter, Breakout Boards


Products in this family provide increased convenience of access to the electrical contacts of a connector, integrated circuit, or similar device by providing interconnection between a component placement area (typically for a fine-pitch, surface mounted integrated circuit) and an interconnect area typically having a much larger distance between pin centers. A common application is accommodating the use of solderless breadboards as a prototyping method for components that are not available in breadboard-compatible packaging.