Prototype Boards Perforated

Results: 4
Manufacturer
Chip Quik Inc.DIGIKEY STANDARDSparkFun Electronics
Series
-Proto-AdvantageSolderFul
Plating
-Plated Through Hole (PTH)
Pitch
0.1" (2.54mm) Grid0.100" (2.54mm)0.100" (2.54mm), 0.200" (5.08mm)
Circuit Pattern
5 Hole Pad (Both Sides)Pad (Square)Pad Per Hole (Round)
Hole Diameter
0.039" (1.00mm)-
Size / Dimension
1.00" L x 1.00" W (25.4mm x 25.4mm)1.75" L x 1.10" W (44.5mm x 27.9mm)3.20" L x 2.00" W (81.3mm x 50.8mm)3.70" L x 2.50" W (94.0mm x 63.5mm)
Board Thickness
0.063" (1.60mm)-
Stocking Options
Environmental Options
Media
Marketplace Product
4Results

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of 4
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Mfr Part #
Quantity Available
Price
Series
Package
Product Status
Proto Board Type
Plating
Pitch
Circuit Pattern
Edge Contacts
Hole Diameter
Size / Dimension
Board Thickness
DKS-SOLDERBREAD-02
DKS-SOLDERBREAD-02
BREADBOARD GENERAL PURPOSE PTH
DIGIKEY STANDARD
5,674
In Stock
1 : ¥9.03000
Bulk
Bulk
Active
Breadboard, General Purpose
Plated Through Hole (PTH)
0.100" (2.54mm)
5 Hole Pad (Both Sides)
-
0.039" (1.00mm)
3.20" L x 2.00" W (81.3mm x 50.8mm)
0.063" (1.60mm)
PRT-08808
PRT-08808
BREADBOARD GENERAL PURPOSE
SparkFun Electronics
1,059
In Stock
1 : ¥16.01000
Bulk
-
Bulk
Active
Breadboard, General Purpose
-
0.1" (2.54mm) Grid
Pad (Square)
-
-
1.00" L x 1.00" W (25.4mm x 25.4mm)
-
PRT-12070
PRT-12070
BREADBOARD GENERAL PURPOSE PTH
SparkFun Electronics
445
In Stock
1 : ¥45.15000
Bulk
-
Bulk
Active
Breadboard, General Purpose
Plated Through Hole (PTH)
0.100" (2.54mm), 0.200" (5.08mm)
5 Hole Pad (Both Sides)
-
-
3.70" L x 2.50" W (94.0mm x 63.5mm)
-
SBBTH1510-1
SBBTH1510-1
BREADBOARD GENERAL PURPOSE PTH
Chip Quik Inc.
469
In Stock
1 : ¥17.77000
Bulk
Bulk
Active
Breadboard, General Purpose
Plated Through Hole (PTH)
0.100" (2.54mm)
Pad Per Hole (Round)
-
0.039" (1.00mm)
1.75" L x 1.10" W (44.5mm x 27.9mm)
0.063" (1.60mm)
Showing
of 4

Prototype Boards Perforated


Products in this category are used as a platform for circuit construction in hobby, experimental, and similar settings where adaptability is desired. Characterized by having a series of holes drilled through their thickness at regular intervals, they may also include a solderable conductive layer around these holes, which may or may not be interconnected, depending on the nature of a specific product. Often used for constructing circuits based on through-hole component packaging, similar products lacking perforation are more commonly used for circuit development using surface mounted components.