Power Driver Modules

Results: 8
Manufacturer
EPC Space, LLCInfineon TechnologiesonsemiSTMicroelectronics
Series
-CIPOS™SLLIMM™
Packaging
BulkTube
Type
IGBTMOSFET
Configuration
3 Phase3 Phase InverterHalf Bridge
Current
10 A15 A25 A30 A35 A450 A
Voltage
50 V600 V750 V1.2 kV
Voltage - Isolation
1500Vrms2000Vrms2500Vrms-
Mounting Type
Chassis MountSurface MountThrough Hole
Package / Case
18-SMD Module24-PowerDIP Module (1.028", 26.10mm)24-PowerDIP Module (1.094", 27.80mm)26-PowerDIP Module (1.146", 29.10mm)38-PowerDIP Module (0.610", 24.00mm), 24 LeadsModule
Stocking Options
Environmental Options
Media
Marketplace Product
8Results
Showing
of 8
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Mfr Part #
Quantity Available
Price
Series
Package
Product Status
Type
Configuration
Current
Voltage
Voltage - Isolation
Mounting Type
Package / Case
112
In Stock
1 : ¥158.61000
Tube
Tube
Active
IGBT
3 Phase
30 A
600 V
2000Vrms
Through Hole
-
CIPOS-Mini_24
IM828XCCXKMA1
CIPOS MAXI 1200V 35A PG-MDIP-24
Infineon Technologies
37
In Stock
1 : ¥777.78000
Tube
Tube
Active
IGBT
3 Phase Inverter
35 A
1.2 kV
2500Vrms
Through Hole
24-PowerDIP Module (1.094", 27.80mm)
795
In Stock
1 : ¥68.14000
Tube
Tube
Active
IGBT
3 Phase
15 A
600 V
2000Vrms
Through Hole
24-PowerDIP Module (1.028", 26.10mm)
173
In Stock
1 : ¥95.73000
Tube
Tube
Active
IGBT
3 Phase
15 A
600 V
2000Vrms
Through Hole
24-PowerDIP Module (1.028", 26.10mm)
174
In Stock
1 : ¥1,296.78000
Tube
-
Tube
Active
IGBT
Half Bridge
450 A
750 V
2500Vrms
Chassis Mount
Module
NFAQ1560R43TL-(primary)
NFAQ1560R43TL
INTELLIGENT POWER MODULE (IPM),
onsemi
217
In Stock
1 : ¥78.98000
Tube
-
Tube
Active
IGBT
3 Phase Inverter
15 A
600 V
2000Vrms
Through Hole
38-PowerDIP Module (0.610", 24.00mm), 24 Leads
20
In Stock
1 : ¥5,647.77000
Bulk
-
Bulk
Active
MOSFET
3 Phase
10 A
50 V
-
Surface Mount
18-SMD Module
STGIB20M60TS-L
STGIB20M60TS-L
SLLIMM 2ND SERIES IPM, 3-PHASE I
STMicroelectronics
40
In Stock
1 : ¥157.71000
Tube
Tube
Active
IGBT
3 Phase Inverter
25 A
600 V
1500Vrms
Through Hole
26-PowerDIP Module (1.146", 29.10mm)
Showing
of 8

Power Driver Modules

Power driver modules provide the physical containment for power components, usually IGBTs and MOSFETs in a half bridge or one-, two- or three-phase configurations. Power semiconductors or dies are soldered or sintered on a substrate that carries the power semiconductors and provides electrical and thermal contact and electrical insulation where needed. Power modules provide a higher power density and are in many cases more reliable and easier to cool.