Single Diodes

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Mfr Part #	Quantity Available	Price	Series	Package	Product Status	Technology	Voltage - DC Reverse (Vr) (Max)	Current - Average Rectified (Io)	Voltage - Forward (Vf) (Max) @ If	Speed	Reverse Recovery Time (trr)	Current - Reverse Leakage @ Vr	Capacitance @ Vr, F	Mounting Type	Package / Case	Supplier Device Package	Operating Temperature - Junction

1N4148W-7-F DIODE GEN PURP 100V 300MA SOD123 Diodes Incorporated	464,043 In Stock	1 : ¥1.31000 Cut Tape (CT) 3,000 : ¥0.23193 Tape & Reel (TR)	-	Tape & Reel (TR) Cut Tape (CT) Digi-Reel®	Active	Standard	100 V	300mA	1.25 V @ 150 mA	Fast Recovery =< 500ns, > 200mA (Io)	4 ns	1 µA @ 100 V	2pF @ 0V, 1MHz	Surface Mount	SOD-123	SOD-123	-55°C ~ 150°C
SS34 DIODE SCHOTTKY 40V 3A SMC onsemi	26,039 In Stock	1 : ¥5.34000 Cut Tape (CT) 3,000 : ¥1.79546 Tape & Reel (TR)	-	Tape & Reel (TR) Cut Tape (CT) Digi-Reel®	Not For New Designs	Schottky	40 V	3A	500 mV @ 3 A	Fast Recovery =< 500ns, > 200mA (Io)	-	500 µA @ 40 V	-	Surface Mount	DO-214AB, SMC	DO-214AB (SMC)	-55°C ~ 150°C
SS310 DIODE SCHOTTKY 100V 3A DO214AB Taiwan Semiconductor Corporation	3,765 In Stock	1 : ¥3.61000 Cut Tape (CT) 3,000 : ¥0.98104 Tape & Reel (TR)	-	Tape & Reel (TR) Cut Tape (CT) Digi-Reel®	Active	Schottky	100 V	3A	-	Fast Recovery =< 500ns, > 200mA (Io)	-	100 µA @ 100 V	-	Surface Mount	DO-214AB, SMC	DO-214AB (SMC)	-55°C ~ 150°C
SS34-E3/57T DIODE SCHOTTKY 40V 3A DO214AB Vishay General Semiconductor - Diodes Division	15,116 In Stock	1 : ¥4.76000 Cut Tape (CT) 850 : ¥2.22360 Tape & Reel (TR)	-	Tape & Reel (TR) Cut Tape (CT)	Active	Schottky	40 V	3A	500 mV @ 3 A	Fast Recovery =< 500ns, > 200mA (Io)	-	500 µA @ 40 V	-	Surface Mount	DO-214AB, SMC	DO-214AB (SMC)	-55°C ~ 125°C

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Single Diodes

Products within the single rectifier diode family are used to allow current flow in one direction only, and implement exactly one instance of this function per device package. Diodes used for other purposes (including zener and variable capacitance diodes) are listed separately in product families of their own, as are products incorporating multiple diodes per device package.