Single Diodes

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Mfr Part #	Quantity Available	Price	Series	Package	Product Status	Technology	Voltage - DC Reverse (Vr) (Max)	Current - Average Rectified (Io)	Voltage - Forward (Vf) (Max) @ If	Speed	Reverse Recovery Time (trr)	Current - Reverse Leakage @ Vr	Capacitance @ Vr, F	Mounting Type	Package / Case	Supplier Device Package	Operating Temperature - Junction

SA2M-E3/5AT DIODE GEN PURP 1KV 2A DO214AC Vishay General Semiconductor - Diodes Division	17,798 In Stock	1 : ¥3.12000 Cut Tape (CT) 7,500 : ¥0.53690 Tape & Reel (TR)	-	Tape & Reel (TR) Cut Tape (CT) Digi-Reel®	Active	Standard	1000 V	2A	1.1 V @ 2 A	Standard Recovery >500ns, > 200mA (Io)	1.5 µs	3 µA @ 1000 V	11pF @ 4V, 1MHz	Surface Mount	DO-214AC, SMA	DO-214AC (SMA)	-55°C ~ 150°C
STPS2L30A DIODE SCHOTTKY 30V 2A SMA STMicroelectronics	3,188 In Stock	1 : ¥3.61000 Cut Tape (CT) 5,000 : ¥0.73501 Tape & Reel (TR)	-	Tape & Reel (TR) Cut Tape (CT) Digi-Reel®	Active	Schottky	30 V	2A	450 mV @ 2 A	Fast Recovery =< 500ns, > 200mA (Io)	-	200 µA @ 30 V	-	Surface Mount	DO-214AC, SMA	SMA	150°C (Max)
SS33 DIODE SCHOTTKY 30V 3A SMC onsemi	8,416 In Stock 681,000 Factory	1 : ¥5.17000 Cut Tape (CT) 3,000 : ¥1.96972 Tape & Reel (TR)	-	Tape & Reel (TR) Cut Tape (CT) Digi-Reel®	Not For New Designs	Schottky	30 V	3A	500 mV @ 3 A	Fast Recovery =< 500ns, > 200mA (Io)	-	500 µA @ 30 V	-	Surface Mount	DO-214AB, SMC	DO-214AB (SMC)	-55°C ~ 150°C
MBRS330T3G DIODE SCHOTTKY 30V 3A SMC onsemi	0 In Stock Check Lead Time	1 : ¥4.93000 Cut Tape (CT) 2,500 : ¥1.65234 Tape & Reel (TR)	-	Tape & Reel (TR) Cut Tape (CT) Digi-Reel®	Active	Schottky	30 V	3A	500 mV @ 3 A	Fast Recovery =< 500ns, > 200mA (Io)	-	2 mA @ 30 V	-	Surface Mount	DO-214AB, SMC	SMC	-65°C ~ 150°C

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Single Diodes

Products within the single rectifier diode family are used to allow current flow in one direction only, and implement exactly one instance of this function per device package. Diodes used for other purposes (including zener and variable capacitance diodes) are listed separately in product families of their own, as are products incorporating multiple diodes per device package.