Single Diodes

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Mfr Part #	Quantity Available	Price	Series	Package	Product Status	Technology	Voltage - DC Reverse (Vr) (Max)	Current - Average Rectified (Io)	Voltage - Forward (Vf) (Max) @ If	Speed	Reverse Recovery Time (trr)	Current - Reverse Leakage @ Vr	Capacitance @ Vr, F	Mounting Type	Package / Case	Supplier Device Package	Operating Temperature - Junction

S3N DIODE GEN PURP 1.2KV 3A SMC onsemi	10,767 In Stock 114,000 Factory	1 : ¥4.68000 Cut Tape (CT) 3,000 : ¥1.58397 Tape & Reel (TR)	-	Tape & Reel (TR) Cut Tape (CT) Digi-Reel®	Not For New Designs	Standard	1200 V	3A	1.2 V @ 3 A	Standard Recovery >500ns, > 200mA (Io)	2.5 µs	5 µA @ 1200 V	60pF @ 4V, 1MHz	Surface Mount	DO-214AB, SMC	DO-214AB (SMC)	-55°C ~ 150°C
STTH212S DIODE GEN PURP 1.2KV 2A SMC STMicroelectronics	58,216 In Stock	1 : ¥4.93000 Cut Tape (CT) 2,500 : ¥1.86100 Tape & Reel (TR)	-	Tape & Reel (TR) Cut Tape (CT) Digi-Reel®	Active	Standard	1200 V	2A	1.75 V @ 2 A	Fast Recovery =< 500ns, > 200mA (Io)	75 ns	10 µA @ 1200 V	-	Surface Mount	DO-214AB, SMC	SMC	175°C (Max)
CMF05(TE12L,Q,M) DIODE GEN PURP 1KV 500MA M-FLAT Toshiba Semiconductor and Storage	17,095 In Stock	1 : ¥4.10000 Cut Tape (CT) 3,000 : ¥1.10805 Tape & Reel (TR)	-	Tape & Reel (TR) Cut Tape (CT) Digi-Reel®	Active	Standard	1000 V	500mA	2.7 V @ 500 mA	Fast Recovery =< 500ns, > 200mA (Io)	100 ns	50 µA @ 800 V	-	Surface Mount	SOD-128	M-FLAT (2.4x3.8)	-40°C ~ 125°C
GN3O RECTIFIER, GENERAL PURPOSE, 3A, Good-Ark Semiconductor	5,850 In Stock	1 : ¥3.69000 Cut Tape (CT) 3,000 : ¥1.24751 Tape & Reel (TR)	-	Tape & Reel (TR) Cut Tape (CT) Digi-Reel®	Active	Standard	1200 V	3A	1.25 V @ 3 A	Standard Recovery >500ns, > 200mA (Io)	1 µs	10 µA @ 1200 V	60pF @ 4V, 1MHz	Surface Mount	DO-214AB, SMC	DO-214AB (SMC)	-55°C ~ 150°C

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Single Diodes

Products within the single rectifier diode family are used to allow current flow in one direction only, and implement exactly one instance of this function per device package. Diodes used for other purposes (including zener and variable capacitance diodes) are listed separately in product families of their own, as are products incorporating multiple diodes per device package.