Single Diodes

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Mfr Part #	Quantity Available	Price	Series	Package	Product Status	Technology	Voltage - DC Reverse (Vr) (Max)	Current - Average Rectified (Io)	Voltage - Forward (Vf) (Max) @ If	Speed	Reverse Recovery Time (trr)	Current - Reverse Leakage @ Vr	Capacitance @ Vr, F	Mounting Type	Package / Case	Supplier Device Package	Operating Temperature - Junction

1N4148WX-TP DIODE GEN PURP 75V 150MA SOD323 Micro Commercial Co	878,083 In Stock	1 : ¥0.82000 Cut Tape (CT) 3,000 : ¥0.15670 Tape & Reel (TR)	-	Tape & Reel (TR) Cut Tape (CT) Digi-Reel®	Active	Standard	75 V	150mA	1 V @ 50 mA	Small Signal =< 200mA (Io), Any Speed	4 ns	5 µA @ 75 V	-	Surface Mount	SC-76, SOD-323	SOD-323	-55°C ~ 150°C
RF101LAM2STR DIODE GEN PURP 200V 1A PMDTM Rohm Semiconductor	6,486 In Stock	1 : ¥3.86000 Cut Tape (CT) 3,000 : ¥0.84602 Tape & Reel (TR)	-	Tape & Reel (TR) Cut Tape (CT) Digi-Reel®	Active	Standard	200 V	1A	870 mV @ 1 A	Fast Recovery =< 500ns, > 200mA (Io)	25 ns	10 µA @ 200 V	-	Surface Mount	SOD-128	PMDTM	150°C (Max)
TPMR10D DIODE GEN PURP 200V 10A TO277A Taiwan Semiconductor Corporation	1,201 In Stock	1 : ¥7.88000 Cut Tape (CT) 1,500 : ¥3.46749 Tape & Reel (TR)	-	Tape & Reel (TR) Cut Tape (CT) Digi-Reel®	Discontinued at Digi-Key	Standard	200 V	10A	950 mV @ 10 A	Fast Recovery =< 500ns, > 200mA (Io)	35 ns	5 µA @ 200 V	140pF @ 4V, 1MHz	Surface Mount	TO-277, 3-PowerDFN	TO-277A (SMPC)	-55°C ~ 175°C
MURS115T3G DIODE GEN PURP 150V 2A SMB onsemi	0 In Stock	1 : ¥4.10000 Cut Tape (CT) 2,500 : ¥1.09913 Tape & Reel (TR)	-	Tape & Reel (TR) Cut Tape (CT) Digi-Reel®	Obsolete	Standard	150 V	2A	875 mV @ 1 A	Fast Recovery =< 500ns, > 200mA (Io)	35 ns	2 µA @ 150 V	-	Surface Mount	DO-214AA, SMB	SMB	-65°C ~ 175°C

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Single Diodes

Products within the single rectifier diode family are used to allow current flow in one direction only, and implement exactly one instance of this function per device package. Diodes used for other purposes (including zener and variable capacitance diodes) are listed separately in product families of their own, as are products incorporating multiple diodes per device package.